HiSilicon Kirin 990 4G | Intel Xeon D-2775TE | |
CPU comparisonHiSilicon Kirin 990 4G or Intel Xeon D-2775TE - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 990 4G has 8 cores with 8 threads and clocks with a maximum frequency of 2.86 GHz. Up to 8 GB of memory is supported in 4 memory channels. The HiSilicon Kirin 990 4G was released in Q3/2019. The Intel Xeon D-2775TE has 16 cores with 32 threads and clocks with a maximum frequency of 3.10 GHz. The CPU supports up to 1024 GB of memory in 4 memory channels. The Intel Xeon D-2775TE was released in Q1/2022. |
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HiSilicon Kirin (29) | Family | Intel Xeon D (79) |
HiSilicon Kirin 990 (3) | CPU group | Intel Xeon D-2700 (16) |
8 | Generation | 4 |
Cortex-A76 / Cortex-A55 | Architecture | Ice Lake |
Mobile | Segment | Desktop / Server |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 990 4G has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 990 4G is 2.86 GHz while the Intel Xeon D-2775TE has 16 CPU cores and 32 threads can calculate simultaneously. The clock frequency of the Intel Xeon D-2775TE is at 2.00 GHz (3.10 GHz). |
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HiSilicon Kirin 990 4G | Characteristic | Intel Xeon D-2775TE |
8 | Cores | 16 |
8 | Threads | 32 |
hybrid (Prime / big.LITTLE) | Core architecture | normal |
No | Hyperthreading | Yes |
No | Overclocking ? | No |
2.86 GHz 2x Cortex-A76 |
A-Core | 2.00 GHz (3.10 GHz) 16x Sunny Cove |
2.09 GHz 2x Cortex-A76 |
B-Core | -- |
1.86 GHz 4x Cortex-A55 |
C-Core | -- |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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HiSilicon Kirin 990 4G | Characteristic | Intel Xeon D-2775TE |
HUAWEI HiAI 2.0 | AI hardware | -- |
Da Vinci Architecture. 1x Ascend Lite + 1x Ascend Tiny | AI specifications | -- |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The HiSilicon Kirin 990 4G or Intel Xeon D-2775TE has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G76 MP16 | GPU | no iGPU |
0.60 GHz | GPU frequency | -- |
-- | GPU (Turbo) | -- |
Bifrost 3 | GPU Generation | -- |
7 nm | Technology | |
2 | Max. displays | |
16 | Compute units | -- |
256 | Shader | -- |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | -- |
12 | DirectX Version | -- |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G76 MP16 | GPU | no iGPU |
Decode / Encode | Codec h265 / HEVC (8 bit) | No |
Decode / Encode | Codec h265 / HEVC (10 bit) | No |
Decode / Encode | Codec h264 | No |
Decode / Encode | Codec VP9 | No |
Decode / Encode | Codec VP8 | No |
No | Codec AV1 | No |
Decode / Encode | Codec AVC | No |
Decode / Encode | Codec VC-1 | No |
Decode / Encode | Codec JPEG | No |
Memory & PCIeThe HiSilicon Kirin 990 4G can use up to 8 GB of memory in 4 memory channels. The maximum memory bandwidth is --. The Intel Xeon D-2775TE supports up to 1024 GB of memory in 4 memory channels and achieves a memory bandwidth of up to 93.8 GB/s. |
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HiSilicon Kirin 990 4G | Characteristic | Intel Xeon D-2775TE |
LPDDR4X-2133 | Memory | DDR4-2933 |
8 GB | Max. Memory | 1024 GB |
4 (Quad Channel) | Memory channels | 4 (Quad Channel) |
-- | Max. Bandwidth | 93.8 GB/s |
No | ECC | Yes |
-- | L2 Cache | 25.00 MB |
2.00 MB | L3 Cache | -- |
-- | PCIe version | 4.0 |
-- | PCIe lanes | 32 |
-- | PCIe Bandwidth | 63.0 GB/s |
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 990 4G is 6 W, while the Intel Xeon D-2775TE has a TDP of 100 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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HiSilicon Kirin 990 4G | Characteristic | Intel Xeon D-2775TE |
6 W | TDP (PL1 / PBP) | 100 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 990 4G is manufactured in 7 nm and has 2.00 MB cache. The Intel Xeon D-2775TE is manufactured in 10 nm and has a 25.00 MB cache. |
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HiSilicon Kirin 990 4G | Characteristic | Intel Xeon D-2775TE |
7 nm | Technology | 10 nm |
Chiplet | Chip design | Monolithic |
Armv8-A (64 bit) | Instruction set (ISA) | x86-64 (64 bit) |
-- | ISA extensions | SSE4.1, SSE4.2, AVX2, AVX-512 |
-- | Socket | BGA 2579 |
None | Virtualization | VT-x, VT-x EPT, VT-d |
No | AES-NI | Yes |
Android | Operating systems | Windows 10, Linux |
Q3/2019 | Release date | Q1/2022 |
-- | Release price | 1784 $ |
show more data | show more data | |
HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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Intel Xeon D-2775TE
16C 32T @ 3.10 GHz |
HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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Intel Xeon D-2775TE
16C 32T @ 2.30 GHz |
HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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Intel Xeon D-2775TE
16C 32T @ 3.10 GHz |
HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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Intel Xeon D-2775TE
16C 32T @ 2.30 GHz |
HiSilicon Kirin 990 4G
ARM Mali-G76 MP16 @ 0.60 GHz |
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Intel Xeon D-2775TE
@ 0.00 GHz |
Devices using this processor |
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HiSilicon Kirin 990 4G | Intel Xeon D-2775TE |
Huawei Mate 30 Pro | Unknown |