HiSilicon Kirin 935 | Qualcomm Snapdragon 8cx | |
CPU comparisonHiSilicon Kirin 935 or Qualcomm Snapdragon 8cx - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 935 has 8 cores with 8 threads and clocks with a maximum frequency of 2.20 GHz. Up to GB of memory is supported in 2 memory channels. The HiSilicon Kirin 935 was released in Q1/2015. The Qualcomm Snapdragon 8cx has 8 cores with 8 threads and clocks with a maximum frequency of 2.84 GHz. The CPU supports up to 16 GB of memory in 8 memory channels. The Qualcomm Snapdragon 8cx was released in Q4/2018. |
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HiSilicon Kirin (29) | Family | Qualcomm Snapdragon (104) |
HiSilicon Kirin 930 (2) | CPU group | Qualcomm Snapdragon 8cx (2) |
3 | Generation | 2 |
Cortex-A53 / Cortex-A53 | Architecture | Kryo 495 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 935 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 935 is 2.20 GHz while the Qualcomm Snapdragon 8cx has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 8cx is at 2.84 GHz. |
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HiSilicon Kirin 935 | Characteristic | Qualcomm Snapdragon 8cx |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.20 GHz 4x Cortex-A53 |
A-Core | 2.84 GHz 4x Kryo 495 Gold |
1.50 GHz 4x Cortex-A53 |
B-Core | 1.80 GHz 4x Kryo 495 Silver |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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HiSilicon Kirin 935 | Characteristic | Qualcomm Snapdragon 8cx |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon 685 @ 3 TOPS |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The HiSilicon Kirin 935 or Qualcomm Snapdragon 8cx has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-T628 MP4 | GPU | Qualcomm Adreno 680 |
0.68 GHz | GPU frequency | 0.25 GHz |
0.68 GHz | GPU (Turbo) | 0.59 GHz |
Midgard 2 | GPU Generation | 5 |
32nm | Technology | 7 nm |
1 | Max. displays | 2 |
4 | Compute units | 8 |
64 | Shader | 768 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 4 GB |
11 | DirectX Version | 12.0 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-T628 MP4 | GPU | Qualcomm Adreno 680 |
No | Codec h265 / HEVC (8 bit) | Decode / Encode |
No | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
No | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode / Encode |
No | Codec AV1 | No |
No | Codec AVC | Decode |
No | Codec VC-1 | Decode |
No | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 935 can use up to GB of memory in 2 memory channels. The maximum memory bandwidth is --. The Qualcomm Snapdragon 8cx supports up to 16 GB of memory in 8 memory channels and achieves a memory bandwidth of up to 68.2 GB/s. |
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HiSilicon Kirin 935 | Characteristic | Qualcomm Snapdragon 8cx |
LPDDR3-1600 | Memory | LPDDR4X-4266 |
Max. Memory | 16 GB | |
2 (Dual Channel) | Memory channels | 8 (Octa Channel) |
-- | Max. Bandwidth | 68.2 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | 2.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 935 is --, while the Qualcomm Snapdragon 8cx has a TDP of 7 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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HiSilicon Kirin 935 | Characteristic | Qualcomm Snapdragon 8cx |
-- | TDP (PL1 / PBP) | 7 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 935 is manufactured in 28 nm and has 0.00 MB cache. The Qualcomm Snapdragon 8cx is manufactured in 7 nm and has a 2.00 MB cache. |
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HiSilicon Kirin 935 | Characteristic | Qualcomm Snapdragon 8cx |
28 nm | Technology | 7 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android, Windows 10 (ARM) |
Q1/2015 | Release date | Q4/2018 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 935
ARM Mali-T628 MP4 @ 0.68 GHz |
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Qualcomm Snapdragon 8cx
Qualcomm Adreno 680 @ 0.59 GHz |
HiSilicon Kirin 935
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 8cx
8C 8T @ 2.84 GHz |
HiSilicon Kirin 935
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 8cx
8C 8T @ 2.84 GHz |
HiSilicon Kirin 935
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 8cx
8C 8T @ 2.84 GHz |
Devices using this processor |
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HiSilicon Kirin 935 | Qualcomm Snapdragon 8cx |
Unknown | Lenovo Flex 5G Lenovo Yoga C 5G Samsung Galaxy Book S |