HiSilicon Kirin 930 | Qualcomm Snapdragon 712 | |
CPU comparisonHiSilicon Kirin 930 or Qualcomm Snapdragon 712 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 930 has 8 cores with 8 threads and clocks with a maximum frequency of 2.00 GHz. Up to GB of memory is supported in 2 memory channels. The HiSilicon Kirin 930 was released in Q1/2015. The Qualcomm Snapdragon 712 has 8 cores with 8 threads and clocks with a maximum frequency of 2.30 GHz. The CPU supports up to 8 GB of memory in 2 memory channels. The Qualcomm Snapdragon 712 was released in Q1/2019. |
||
HiSilicon Kirin (29) | Family | Qualcomm Snapdragon (104) |
HiSilicon Kirin 930 (2) | CPU group | Qualcomm Snapdragon 710 (2) |
3 | Generation | 1 |
Cortex-A53 / Cortex-A53 | Architecture | Kryo 360 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
|
||
CPU Cores and Base FrequencyThe HiSilicon Kirin 930 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 930 is 2.00 GHz while the Qualcomm Snapdragon 712 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 712 is at 2.30 GHz. |
||
HiSilicon Kirin 930 | Characteristic | Qualcomm Snapdragon 712 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.00 GHz 4x Cortex-A53 |
A-Core | 2.30 GHz 2x Kryo 360 Gold |
1.50 GHz 4x Cortex-A53 |
B-Core | 1.70 GHz 6x Kryo 360 Silver |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
||
HiSilicon Kirin 930 | Characteristic | Qualcomm Snapdragon 712 |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon 685 @ 3 TOPS |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The HiSilicon Kirin 930 or Qualcomm Snapdragon 712 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
||
ARM Mali-T628 MP4 | GPU | Qualcomm Adreno 616 |
0.60 GHz | GPU frequency | 0.75 GHz |
0.60 GHz | GPU (Turbo) | 0.75 GHz |
Midgard 2 | GPU Generation | 6 |
32nm | Technology | 10 nm |
1 | Max. displays | 0 |
4 | Compute units | -- |
64 | Shader | 256 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | -- |
11 | DirectX Version | 12.1 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
||
ARM Mali-T628 MP4 | GPU | Qualcomm Adreno 616 |
No | Codec h265 / HEVC (8 bit) | Decode |
No | Codec h265 / HEVC (10 bit) | Decode |
Decode / Encode | Codec h264 | Decode |
No | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode |
No | Codec AV1 | No |
No | Codec AVC | Decode |
No | Codec VC-1 | Decode |
No | Codec JPEG | Decode |
Memory & PCIeThe HiSilicon Kirin 930 can use up to GB of memory in 2 memory channels. The maximum memory bandwidth is --. The Qualcomm Snapdragon 712 supports up to 8 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 14.9 GB/s. |
||
HiSilicon Kirin 930 | Characteristic | Qualcomm Snapdragon 712 |
LPDDR3-1600 | Memory | LPDDR4X-3733 |
Max. Memory | 8 GB | |
2 (Dual Channel) | Memory channels | 2 (Dual Channel) |
-- | Max. Bandwidth | 14.9 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 930 is --, while the Qualcomm Snapdragon 712 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
||
HiSilicon Kirin 930 | Characteristic | Qualcomm Snapdragon 712 |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 930 is manufactured in 28 nm and has 0.00 MB cache. The Qualcomm Snapdragon 712 is manufactured in 10 nm and has a 0.00 MB cache. |
||
HiSilicon Kirin 930 | Characteristic | Qualcomm Snapdragon 712 |
28 nm | Technology | 10 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q1/2015 | Release date | Q1/2019 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 930
ARM Mali-T628 MP4 @ 0.60 GHz |
|||
Qualcomm Snapdragon 712
Qualcomm Adreno 616 @ 0.75 GHz |
HiSilicon Kirin 930
8C 8T @ 2.00 GHz |
|||
Qualcomm Snapdragon 712
8C 8T @ 2.30 GHz |
HiSilicon Kirin 930
8C 8T @ 2.00 GHz |
|||
Qualcomm Snapdragon 712
8C 8T @ 2.30 GHz |
HiSilicon Kirin 930
8C 8T @ 2.00 GHz |
|||
Qualcomm Snapdragon 712
8C 8T @ 2.30 GHz |
HiSilicon Kirin 930
8C 8T @ 2.00 GHz |
|||
Qualcomm Snapdragon 712
8C 8T @ 2.30 GHz |
HiSilicon Kirin 930
8C 8T @ 2.00 GHz |
|||
Qualcomm Snapdragon 712
8C 8T @ 2.30 GHz |
HiSilicon Kirin 930
8C 8T @ 2.00 GHz |
|||
Qualcomm Snapdragon 712
8C 8T @ 2.30 GHz |
HiSilicon Kirin 930
8C 8T @ 2.00 GHz |
|||
Qualcomm Snapdragon 712
8C 8T @ 2.30 GHz |
HiSilicon Kirin 930
8C 8T @ 2.00 GHz |
|||
Qualcomm Snapdragon 712
8C 8T @ 2.30 GHz |
Devices using this processor |
|
HiSilicon Kirin 930 | Qualcomm Snapdragon 712 |
Unknown | Unknown |