HiSilicon Kirin 650 | Qualcomm Snapdragon 439 | |
CPU comparisonHiSilicon Kirin 650 or Qualcomm Snapdragon 439 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 650 has 8 cores with 8 threads and clocks with a maximum frequency of 2.00 GHz. Up to GB of memory is supported in 2 memory channels. The HiSilicon Kirin 650 was released in Q2/2016. The Qualcomm Snapdragon 439 has 8 cores with 8 threads and clocks with a maximum frequency of 1.95 GHz. The CPU supports up to 4 GB of memory in 1 memory channels. The Qualcomm Snapdragon 439 was released in Q3/2018. |
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HiSilicon Kirin (29) | Family | Qualcomm Snapdragon (104) |
HiSilicon Kirin 650 (4) | CPU group | Qualcomm Snapdragon 439 (1) |
4 | Generation | 4 |
Cortex-A53 / Cortex-A53 | Architecture | Cortex-A53 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 650 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 650 is 2.00 GHz while the Qualcomm Snapdragon 439 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 439 is at 1.95 GHz. |
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HiSilicon Kirin 650 | Characteristic | Qualcomm Snapdragon 439 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.00 GHz 4x Cortex-A53 |
A-Core | 1.95 GHz 4x Cortex-A53 |
1.70 GHz 4x Cortex-A53 |
B-Core | 1.45 GHz 4x Cortex-A53 |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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HiSilicon Kirin 650 | Characteristic | Qualcomm Snapdragon 439 |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon 536 |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The HiSilicon Kirin 650 or Qualcomm Snapdragon 439 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-T830 MP2 | GPU | Qualcomm Adreno 505 |
0.90 GHz | GPU frequency | 0.45 GHz |
-- | GPU (Turbo) | 0.45 GHz |
Midgard 4 | GPU Generation | 5 |
28nm | Technology | 28 nm |
2 | Max. displays | 0 |
2 | Compute units | -- |
32 | Shader | 48 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | -- |
11 | DirectX Version | 11 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-T830 MP2 | GPU | Qualcomm Adreno 505 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
Decode | Codec h265 / HEVC (10 bit) | No |
Decode / Encode | Codec h264 | Decode / Encode |
No | Codec VP9 | No |
Decode / Encode | Codec VP8 | No |
No | Codec AV1 | No |
No | Codec AVC | No |
No | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 650 can use up to GB of memory in 2 memory channels. The maximum memory bandwidth is --. The Qualcomm Snapdragon 439 supports up to 4 GB of memory in 1 memory channels and achieves a memory bandwidth of up to 5.4 GB/s. |
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HiSilicon Kirin 650 | Characteristic | Qualcomm Snapdragon 439 |
LPDDR3-933 | Memory | LPDDR3-1333 |
Max. Memory | 4 GB | |
2 (Dual Channel) | Memory channels | 1 (Single Channel) |
-- | Max. Bandwidth | 5.4 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 650 is --, while the Qualcomm Snapdragon 439 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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HiSilicon Kirin 650 | Characteristic | Qualcomm Snapdragon 439 |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 650 is manufactured in 16 nm and has 0.00 MB cache. The Qualcomm Snapdragon 439 is manufactured in 12 nm and has a 0.00 MB cache. |
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HiSilicon Kirin 650 | Characteristic | Qualcomm Snapdragon 439 |
16 nm | Technology | 12 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q2/2016 | Release date | Q3/2018 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 650
8C 8T @ 2.00 GHz |
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Qualcomm Snapdragon 439
8C 8T @ 1.95 GHz |
HiSilicon Kirin 650
8C 8T @ 2.00 GHz |
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Qualcomm Snapdragon 439
8C 8T @ 1.95 GHz |
HiSilicon Kirin 650
ARM Mali-T830 MP2 @ 0.90 GHz |
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Qualcomm Snapdragon 439
Qualcomm Adreno 505 @ 0.45 GHz |
HiSilicon Kirin 650
8C 8T @ 2.00 GHz |
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Qualcomm Snapdragon 439
8C 8T @ 1.95 GHz |
HiSilicon Kirin 650
8C 8T @ 2.00 GHz |
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Qualcomm Snapdragon 439
8C 8T @ 1.95 GHz |
HiSilicon Kirin 650
8C 8T @ 2.00 GHz |
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Qualcomm Snapdragon 439
8C 8T @ 1.95 GHz |
HiSilicon Kirin 650
8C 8T @ 2.00 GHz |
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Qualcomm Snapdragon 439
8C 8T @ 1.95 GHz |
Devices using this processor |
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HiSilicon Kirin 650 | Qualcomm Snapdragon 439 |
Unknown | Unknown |