姓: | MediaTek Dimensity 1100 |
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家庭: | Mediatek Dimensity (36) |
CPU組: | MediaTek Dimensity 1100/1200/1300 (3) |
架構: | Cortex-A78 / Cortex-A55 |
部分: | Mobile |
一代: | 2 |
前任: | -- |
接班人: | -- |
CPU 核心 / Threads: | 8 / 8 |
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核心架構: | hybrid (big.LITTLE) |
A-Core: | 4x Cortex-A78 |
B-Core: | 4x Cortex-A55 |
超執行緒技術 / SMT: | 否 |
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超頻: | 否 |
A-Core 頻率: | 2.60 GHz |
B-Core 頻率: | 2.00 GHz |
GPU型號: | ARM Mali-G77 MP9 |
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GPU頻率: | 0.85 GHz |
GPU (加速頻率): | 無加速頻率 |
運算單元: | 9 |
Shader: | 144 |
Hardware Raytracing: | 否 |
發售日期: | Q2/2019 |
最大加速頻率: | 1 |
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Generation: | Vallhall 1 |
Direct X: | 12 |
製程: | 7 nm |
最大顯存: | 4 GB |
Frame Generation: | 否 |
h265 / HEVC (8 bit): | 解碼 / 編碼 |
---|---|
h265 / HEVC (10 bit): | 解碼 / 編碼 |
h264: | 解碼 / 編碼 |
VP8: | 解碼 / 編碼 |
VP9: | 解碼 / 編碼 |
AV1: | 解碼 |
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AVC: | 解碼 / 編碼 |
VC-1: | 解碼 / 編碼 |
JPEG: | 解碼 / 編碼 |
記憶體 & PCIe內存類型和內存量會極大地影響處理器的速度。 內存帶寬取決於幾個因素,以每秒千兆字節為單位。 |
|
記憶體類型: | 內存帶寬: |
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LPDDR4X-4266 | 34.1 GB/s |
最大記憶體: | 16 GB |
記憶體通道: | 4 (Quad Channel) |
ECC: | 否 |
PCIe: | |
PCIe 帶寬: | -- |
散熱管理熱設計功率(簡稱 TDP)指定了充分冷卻處理器所需的冷卻解決方案。 TDP 通常只給出一個 CPU 實際消耗的粗略概念。 |
|
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TDP (PL1 / PBP): | |
TDP (PL2): | -- |
TDP up: | -- |
TDP down: | -- |
Tjunction max.: | -- |
製程: | 6 nm |
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芯片設計: | 小芯片 |
針腳: | -- |
L2-Cache: | -- |
L3-Cache: | -- |
AES-NI: | 否 |
操作系統: | Android |
虛擬化: | 無 |
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指令集 (ISA): | Armv8-A (64 bit) |
ISA擴展: | -- |
發售日期: | Q1/2021 |
發布價格: | -- |
代號: | MT6891Z/CZA |
文件: | 技術數據表 |
Intel Core i7-4700HQ
4C 8T @ 3.40 GHz |
|||
Intel Core i7-4700MQ
4C 8T @ 3.40 GHz |
|||
Intel Core i5-7Y54
2C 4T @ 3.20 GHz |
|||
MediaTek Dimensity 1100
8C 8T @ 2.60 GHz |
|||
Samsung Exynos 9820
8C 8T @ 2.70 GHz |
|||
Samsung Exynos 1280
8C 8T @ 2.40 GHz |
|||
Intel Xeon E5-2696 v2
12C 24T @ 3.30 GHz |
HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
|||
HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
|||
HiSilicon Kirin 990E 5G
8C 8T @ 2.86 GHz |
|||
MediaTek Dimensity 1100
8C 8T @ 2.60 GHz |
|||
AMD Ryzen 5 2400GE
4C 8T @ 3.20 GHz |
|||
Intel Core i7-3632QM
4C 8T @ 2.20 GHz |
|||
Intel Core i7-4720HQ
4C 8T @ 3.40 GHz |
AMD Ryzen 3 3300U
4C 4T @ 3.50 GHz |
|||
Intel Core i5-6300U
2C 4T @ 3.00 GHz |
|||
Intel Core i5-6400T
4C 4T @ 2.80 GHz |
|||
MediaTek Dimensity 1100
8C 8T @ 2.60 GHz |
|||
Intel Core i7-4702MQ
4C 8T @ 3.20 GHz |
|||
Intel Core i7-4702HQ
4C 8T @ 3.20 GHz |
|||
AMD Ryzen 3 5125C
2C 4T @ 3.00 GHz |
MediaTek Dimensity 1300
8C 8T @ 3.00 GHz |
|||
Intel Processor N100
4C 4T @ 3.00 GHz |
|||
Qualcomm Snapdragon 865+
8C 8T @ 3.10 GHz |
|||
MediaTek Dimensity 1100
8C 8T @ 2.60 GHz |
|||
AMD Ryzen 5 3550H
4C 8T @ 3.00 GHz |
|||
MediaTek Dimensity 1000+
8C 8T @ 2.60 GHz |
|||
AMD Ryzen 7 3700C
4C 8T @ 2.70 GHz |
Apple A12X Bionic
Apple A12X @ 1.13 GHz |
|||
Intel Core i3-13300HE
Intel UHD Graphics 13th Gen (48 EU) @ 1.30 GHz |
|||
Intel Core i3-13300HRE
Intel UHD Graphics 13th Gen (48 EU) @ 1.30 GHz |
|||
MediaTek Dimensity 1100
ARM Mali-G77 MP9 @ 0.85 GHz |
|||
MediaTek Dimensity 8050
ARM Mali-G77 MP9 @ 0.85 GHz |
|||
MediaTek Dimensity 8020
ARM Mali-G77 MP9 @ 0.85 GHz |
|||
MediaTek Dimensity 1300
ARM Mali-G77 MP9 @ 0.85 GHz |
MediaTek Dimensity 1200
8C 8T @ 3.00 GHz |
|||
Qualcomm Snapdragon 865
8C 8T @ 2.84 GHz |
|||
Apple A13 Bionic
6C 6T @ 2.65 GHz |
|||
MediaTek Dimensity 1100
8C 8T @ 2.60 GHz |
|||
Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
|||
Qualcomm Snapdragon 855 Plus
8C 8T @ 2.96 GHz |
|||
HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
|||
Qualcomm Snapdragon 870
8C 8T @ 3.20 GHz |
|||
MediaTek Dimensity 1300
8C 8T @ 3.00 GHz |
|||
MediaTek Dimensity 1100
8C 8T @ 2.60 GHz |
|||
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
|||
Apple A14 Bionic
6C 6T @ 3.00 GHz |
|||
MediaTek Dimensity 1200
8C 8T @ 3.00 GHz |
Intel Core i7-5700HQ
4C 8T @ 3.20 GHz |
|||
Intel Core i5-6600
4C 4T @ 3.60 GHz |
|||
Intel Core i5-7500
4C 4T @ 3.60 GHz |
|||
MediaTek Dimensity 1100
8C 8T @ 2.60 GHz |
|||
AMD FX-8350
8C 8T @ 4.10 GHz |
|||
Intel Core i5-1030NG7
4C 8T @ 3.20 GHz |
|||
Intel Core i7-8550U
4C 8T @ 2.40 GHz |