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Qualcomm Snapdragon Microsoft SQ2 vs Intel Core 7 processor 240H
Dernière mise à jour:
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Wischen
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Qualcomm Snapdragon Microsoft SQ2 | Intel Core 7 processor 240H |
|---|---|---|
| Famille | Qualcomm Snapdragon (105) | Intel Core 7 (11) |
| Groupe de processeurs | Qualcomm Snapdragon SQ1/SQ2 (2) | Intel Core processors - Mobile (Series 2) (6) |
| Architecture | Kryo 495 | Raptor Lake |
| La technologie | 7 nm | 10 nm |
| Segment | Notebook | Notebook |
| Socket | BGA 1744 | |
| Prédécesseur | ||
| Successeur |
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Wischen
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Qualcomm Snapdragon Microsoft SQ2 | Intel Core 7 processor 240H |
|---|---|---|
| CPU Cores / Threads | 8 / 8 | 10 / 16 |
| Hyperthreading / SMT | ✗ | ✓ |
| Architecture de base | hybrid (big.LITTLE) | hybrid (big.LITTLE) |
| Core Cluster 1: | 4x Kryo 495 Gold 3.15 GHz |
6x Golden Cove 2.50 - 5.20 GHz |
| Core Cluster 2: | 4x Kryo 495 Silver 2.42 GHz |
4x Gracemont 1.80 - 4.00 GHz |
| L2-Cache | ||
| L3-Cache | 24.00 MB | |
| Overclocking | ✗ | ✗ |
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Wischen
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Qualcomm Snapdragon Microsoft SQ2 | Intel Core 7 processor 240H |
|---|---|---|
| Nom du GPU | Qualcomm Adreno 690 | Intel UHD Graphics Xe G4 (48 EUs) |
| Fréquence GPU | 0.30 - 1.40 GHz | |
| CUs / Shader | / | 48 / 384 |
| Raytracing | ✗ | ✗ |
| Max. affiche | 0 | 4 |
| Max. GPU Mémoire | 96 Go | |
| La technologie | 7 nm | 10 nm |
| Date de sortie | Q2/2020 | Q3/2020 |
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Wischen
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Qualcomm Snapdragon Microsoft SQ2 | Intel Core 7 processor 240H |
|---|---|---|
| Matériel AI | Intel® AI Boost | |
| Spécifications de l'IA | Intel Deep Learning Boost (Intel DL Boost) CPU | |
| NPU + CPU + iGPU |
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Wischen
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Qualcomm Snapdragon Microsoft SQ2 | Intel Core 7 processor 240H |
|---|---|---|
| Mémoire | LPDDR4X-2133 (68.3 Go/s) | DDR5-6400 (102.4 Go/s) LPDDR5X-6400 (102.4 Go/s) LPDDR4X-4266 (68.3 Go/s) DDR4-3200 (51.2 Go/s) |
| Max. Mémoire | 16 Go | 96 Go |
| Canaux de mémoire | 8 | 2 |
| ECC | Non | Non |
| PCIe | 5.0 x 28 | |
| PCIe Bande passante | 110.3 Go/s |
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Wischen
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Qualcomm Snapdragon Microsoft SQ2 | Intel Core 7 processor 240H |
|---|---|---|
| TDP | 45 W | |
| TDP (PL2) | ||
| TDP up | 115 W | |
| TDP down | 35 W | |
| T. junction max. | 100 °C |
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Wischen
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Qualcomm Snapdragon Microsoft SQ2 | Intel Core 7 processor 240H |
|---|---|---|
| Conception de puce | Chiplet | Monolithique |
| AES-NI | ✗ | ✓ |
| Systèmes d'exploitation | Android, Windows 10 (ARM) | Windows 11, Linux |
| Jeu d'instructions | Armv8-A (64 bit) | x86-64 (64 bit) |
| Extensions ISA | SSE4.1, SSE4.2, AVX2 | |
| Date de sortie | Q3/2020 | Q4/2024 |
| Prix de sortie | ||
| Documents | Fiche technique |