VS
Qualcomm Snapdragon 8c vs Intel Core 5 processor 130HL
Dernière mise à jour:
|
Wischen
|
Qualcomm Snapdragon 8c | Intel Core 5 processor 130HL |
|---|---|---|
| Famille | Qualcomm Snapdragon (105) | Intel Core 5 (13) |
| Groupe de processeurs | Qualcomm Snapdragon 8c (1) | Intel Core processors - Desktop (Series 1) (10) |
| Architecture | Kryo 490 | Raptor Lake |
| La technologie | 7 nm | 10 nm |
| Segment | Smartphone / Tablet | Desktop |
| Socket | LGA 1700 | |
| Prédécesseur | ||
| Successeur |
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Wischen
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Qualcomm Snapdragon 8c | Intel Core 5 processor 130HL |
|---|---|---|
| CPU Cores / Threads | 8 / 8 | 12 / 16 |
| Hyperthreading / SMT | ✗ | ✓ |
| Architecture de base | hybrid (big.LITTLE) | hybrid (big.LITTLE) |
| Core Cluster 1: | 4x Kryo 490 Gold 2.45 GHz |
4x Redwood Cove 4.80 GHz |
| Core Cluster 2: | 4x Kryo 490 Silver 1.80 GHz |
8x Crestmont 3.60 GHz |
| L2-Cache | 2.00 MB | 18.00 MB |
| L3-Cache | 3.00 MB | |
| Overclocking | ✗ | ✗ |
|
Wischen
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Qualcomm Snapdragon 8c | Intel Core 5 processor 130HL |
|---|---|---|
| Nom du GPU | Qualcomm Adreno 675 | Intel Iris Xe Graphics 80 (Alder Lake) |
| Fréquence GPU | 0.25 - 0.59 GHz | 0.40 - 1.50 GHz |
| CUs / Shader | 7 / 672 | 80 / 640 |
| Raytracing | ✗ | ✗ |
| Max. affiche | 1 | 4 |
| Max. GPU Mémoire | 4 Go | 32 Go |
| La technologie | 7 nm | 10 nm |
| Date de sortie | Q4/2018 | Q1/2022 |
|
Wischen
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Qualcomm Snapdragon 8c | Intel Core 5 processor 130HL |
|---|---|---|
| Matériel AI | Qualcomm AI engine | Intel® AI Boost |
| Spécifications de l'IA | Hexagon 690 @ 7 TOPS | Intel Deep Learning Boost (Intel DL Boost) |
| NPU + CPU + iGPU |
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Wischen
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Qualcomm Snapdragon 8c | Intel Core 5 processor 130HL |
|---|---|---|
| Mémoire | LPDDR4X-4266 (34.1 Go/s) | DDR5-5200 (83.2 Go/s) DDR4-3200 (51.2 Go/s) |
| Max. Mémoire | 16 Go | 96 Go |
| Canaux de mémoire | 4 | 2 |
| ECC | Non | Non |
| PCIe | 4.0 x 20 | |
| PCIe Bande passante | 39.4 Go/s |
|
Wischen
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Qualcomm Snapdragon 8c | Intel Core 5 processor 130HL |
|---|---|---|
| TDP | 7 W | 45 W |
| TDP (PL2) | 95 W | |
| TDP up | 65 W | |
| TDP down | 35 W | |
| T. junction max. | 100 °C |
|
Wischen
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Qualcomm Snapdragon 8c | Intel Core 5 processor 130HL |
|---|---|---|
| Conception de puce | Chiplet | Monolithique |
| AES-NI | ✗ | ✓ |
| Systèmes d'exploitation | Android, Windows 10 (ARM) | Windows 11, Linux |
| Jeu d'instructions | Armv8-A (64 bit) | x86-64 (64 bit) |
| Extensions ISA | SSE4.1, SSE4.2, AVX2 | |
| Date de sortie | Q4/2019 | Q2/2024 |
| Prix de sortie | 311 $ | |
| Documents | Fiche technique | Fiche technique |