VS
Qualcomm Snapdragon 615 vs Intel Core 3 processor 100U
Dernière mise à jour:
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Wischen
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Qualcomm Snapdragon 615 | Intel Core 3 processor 100U |
|---|---|---|
| Famille | Qualcomm Snapdragon (105) | Intel Core 3 (5) |
| Groupe de processeurs | Qualcomm Snapdragon 610 (4) | Intel Core processors - Mobile (Series 1) (3) |
| Architecture | Cortex-A53 | Raptor Lake U |
| La technologie | 28 nm | 10 nm |
| Segment | Smartphone / Tablet | Notebook |
| Socket | BGA 1744 | |
| Prédécesseur | ||
| Successeur |
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Wischen
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Qualcomm Snapdragon 615 | Intel Core 3 processor 100U |
|---|---|---|
| CPU Cores / Threads | 8 / 8 | 6 / 8 |
| Hyperthreading / SMT | ✗ | ✓ |
| Architecture de base | hybrid (big.LITTLE) | hybrid (big.LITTLE) |
| Core Cluster 1: | 4x Cortex-A53 1.50 GHz |
2x Redwood Cove 1.20 - 4.70 GHz |
| Core Cluster 2: | 4x Cortex-A53 1.00 GHz |
4x Crestmont 0.90 - 3.30 GHz |
| L2-Cache | 10.00 MB | |
| L3-Cache | ||
| Overclocking | ✗ | ✗ |
|
Wischen
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Qualcomm Snapdragon 615 | Intel Core 3 processor 100U |
|---|---|---|
| Nom du GPU | Qualcomm Adreno 405 | Intel Iris Xe Graphics 64 (Alder Lake) |
| Fréquence GPU | 0.55 - 0.55 GHz | 0.35 - 1.25 GHz |
| CUs / Shader | / 48 | 64 / 512 |
| Raytracing | ✗ | ✗ |
| Max. affiche | 0 | 4 |
| Max. GPU Mémoire | 32 Go | |
| La technologie | 28 nm | 10 nm |
| Date de sortie | Q1/2014 | Q1/2022 |
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Wischen
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Qualcomm Snapdragon 615 | Intel Core 3 processor 100U |
|---|---|---|
| Matériel AI | Qualcomm AI engine | Intel® AI Boost |
| Spécifications de l'IA | Hexagon | Intel Deep Learning Boost (Intel DL Boost) |
| NPU + CPU + iGPU |
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Wischen
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Qualcomm Snapdragon 615 | Intel Core 3 processor 100U |
|---|---|---|
| Mémoire | LPDDR3-1600 (6.4 Go/s) | LPDDR5-5200 (83.2 Go/s) DDR5-5200 (83.2 Go/s) LPDDR4X-4266 (68.2 Go/s) DDR4-3200 (51.2 Go/s) |
| Max. Mémoire | 4 Go | 96 Go |
| Canaux de mémoire | 1 | 2 |
| ECC | Non | Non |
| PCIe | 4.0 x 20 | |
| PCIe Bande passante | 39.4 Go/s |
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Wischen
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Qualcomm Snapdragon 615 | Intel Core 3 processor 100U |
|---|---|---|
| TDP | 15 W | |
| TDP (PL2) | 55 W | |
| TDP up | ||
| TDP down | 12 W | |
| T. junction max. | 100 °C |
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Wischen
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Qualcomm Snapdragon 615 | Intel Core 3 processor 100U |
|---|---|---|
| Conception de puce | Chiplet | Monolithique |
| AES-NI | ✗ | ✓ |
| Systèmes d'exploitation | Android | Windows 11, Linux |
| Jeu d'instructions | Armv8-A (64 bit) | x86-64 (64 bit) |
| Extensions ISA | SSE4.1, SSE4.2, AVX2 | |
| Date de sortie | Q3/2014 | Q1/2024 |
| Prix de sortie | ||
| Documents | Fiche technique | Fiche technique |