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MediaTek Dimensity 8050 vs Intel Core Ultra 7 365H
Dernière mise à jour:
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Wischen
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MediaTek Dimensity 8050 | Intel Core Ultra 7 365H |
|---|---|---|
| Famille | Mediatek Dimensity (38) | Intel Core Ultra 7 (31) |
| Groupe de processeurs | MediaTek Dimensity 8000 (4) | Intel Core Ultra 300H (8) |
| Architecture | Cortex-A78 / Cortex-A55 | Panther Lake H |
| La technologie | 5 nm | 2 nm |
| Segment | Smartphone / Tablet | Notebook |
| Socket | BGA 2540 | |
| Prédécesseur | ||
| Successeur |
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Wischen
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MediaTek Dimensity 8050 | Intel Core Ultra 7 365H |
|---|---|---|
| CPU Cores / Threads | 8 / 8 | 16 / 16 |
| Hyperthreading / SMT | ✗ | ✗ |
| Architecture de base | hybrid (Prime / big.LITTLE) | hybrid (big.LITTLE) |
| Core Cluster 1: | 1x Cortex-A78 3.00 GHz |
4x Cougar Cove 1.90 - 4.70 GHz |
| Core Cluster 2: | 4x Cortex-A78 2.60 GHz |
8x Darkmont 1.50 - 3.50 GHz |
| Core Cluster 3: | 4x Cortex-A55 2.00 GHz |
4x Darkmont LP 1.50 - 3.30 GHz |
| L2-Cache | 16.00 MB | |
| L3-Cache | 18.00 MB | |
| Overclocking | ✗ | ✗ |
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Wischen
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MediaTek Dimensity 8050 | Intel Core Ultra 7 365H |
|---|---|---|
| Nom du GPU | ARM Mali-G77 MP9 | Intel Xe3 4 Core Graphics 32 EUs (Panther Lake) |
| Fréquence GPU | 0.85 GHz | 0.00 - 2.45 GHz |
| CUs / Shader | 9 / 144 | 32 / 512 |
| Raytracing | ✗ | ✓ |
| Max. affiche | 1 | 4 |
| Max. GPU Mémoire | 4 Go | 128 Go |
| La technologie | 7 nm | 3 nm |
| Date de sortie | Q2/2019 | Q1/2026 |
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Wischen
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MediaTek Dimensity 8050 | Intel Core Ultra 7 365H |
|---|---|---|
| Matériel AI | Intel® AI Boost | |
| Spécifications de l'IA | Intel AI Boost NPU 5 @ 50 TOPS | |
| NPU + CPU + iGPU |
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Wischen
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MediaTek Dimensity 8050 | Intel Core Ultra 7 365H |
|---|---|---|
| Mémoire | LPDDR4X-4266 (34.1 Go/s) | LPDDR5X-8533 (135.5 Go/s) DDR5-7200 (115.2 Go/s) |
| Max. Mémoire | 16 Go | 128 Go |
| Canaux de mémoire | 4 | 2 |
| ECC | Non | Non |
| PCIe | 5.0 x 20 | |
| PCIe Bande passante | 78.8 Go/s |
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Wischen
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MediaTek Dimensity 8050 | Intel Core Ultra 7 365H |
|---|---|---|
| TDP | 25 W | |
| TDP (PL2) | ||
| TDP up | 80 W | |
| TDP down | 15 W | |
| T. junction max. | 100 °C |
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Wischen
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MediaTek Dimensity 8050 | Intel Core Ultra 7 365H |
|---|---|---|
| Conception de puce | Chiplet | Chiplet |
| AES-NI | ✗ | ✓ |
| Systèmes d'exploitation | Android | Windows 11, Linux |
| Jeu d'instructions | Armv8-A (64 bit) | x86-64 (64 bit) |
| Extensions ISA | SSE4.1, SSE4.2, AVX2 | |
| Date de sortie | Q2/2023 | Q1/2026 |
| Prix de sortie | ||
| Documents | Fiche technique | Fiche technique |