VS
Intel Processor N97 vs Qualcomm Snapdragon 8 Gen 3
Dernière mise à jour:
|
Wischen
|
Intel Processor N97 | Qualcomm Snapdragon 8 Gen 3 |
|---|---|---|
| Famille | Intel Processor N (9) | Qualcomm Snapdragon (105) |
| Groupe de processeurs | Intel Processor N50/N100/N200 (5) | Qualcomm Snapdragon 8 Gen 3 (2) |
| Architecture | Alder Lake N | |
| La technologie | 10 nm | 4 nm |
| Segment | Notebook | Smartphone / Tablet |
| Socket | BGA | |
| Prédécesseur | Qualcomm Snapdragon 8 Gen 2 | |
| Successeur | Qualcomm Snapdragon 8 Elite |
|
Wischen
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Intel Processor N97 | Qualcomm Snapdragon 8 Gen 3 |
|---|---|---|
| CPU Cores / Threads | 4 / 4 | 8 / 8 |
| Hyperthreading / SMT | ✗ | ✗ |
| Architecture de base | normal | hybrid (Prime / big.LITTLE) |
| Core Cluster 1: | 4x Gracemont 2.00 - 3.60 GHz |
1x Cortex-X4 3.40 GHz |
| Core Cluster 2: | 5x Cortex-A720 2.96 - 3.15 GHz |
|
| Core Cluster 3: | 2x Cortex-A520 2.27 GHz |
|
| L2-Cache | 4.00 MB | |
| L3-Cache | 6.00 MB | 12.00 MB |
| Overclocking | ✗ | ✗ |
|
Wischen
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Intel Processor N97 | Qualcomm Snapdragon 8 Gen 3 |
|---|---|---|
| Nom du GPU | Intel UHD Graphics 24 EUs (Alder Lake) | Qualcomm Adreno 750 |
| Fréquence GPU | 1.20 GHz | 0.90 GHz |
| CUs / Shader | 24 / 192 | / |
| Raytracing | ✗ | ✓ |
| Max. affiche | 3 | 2 |
| Max. GPU Mémoire | 8 Go | 6 Go |
| La technologie | 10 nm | 4 nm |
| Date de sortie | Q1/2023 | Q4/2023 |
|
Wischen
|
Intel Processor N97 | Qualcomm Snapdragon 8 Gen 3 |
|---|---|---|
| Matériel AI | Qualcomm AI engine | |
| Spécifications de l'IA | Hexagon NPU @ 34 TOPS | |
| NPU + CPU + iGPU |
|
Wischen
|
Intel Processor N97 | Qualcomm Snapdragon 8 Gen 3 |
|---|---|---|
| Mémoire | LPDDR5-4800 (38.4 Go/s) DDR5-4800 (38.4 Go/s) DDR4-3200 (25.6 Go/s) | LPDDR5X-9600 (76.6 Go/s) |
| Max. Mémoire | 16 Go | 24 Go |
| Canaux de mémoire | 1 | 4 |
| ECC | Non | Non |
| PCIe | 3.0 x 9 | |
| PCIe Bande passante | 8.9 Go/s |
|
Wischen
|
Intel Processor N97 | Qualcomm Snapdragon 8 Gen 3 |
|---|---|---|
| TDP | 12 W | 12.5 W |
| TDP (PL2) | ||
| TDP up | ||
| TDP down | ||
| T. junction max. | 105 °C |
|
Wischen
|
Intel Processor N97 | Qualcomm Snapdragon 8 Gen 3 |
|---|---|---|
| Conception de puce | Monolithique | Chiplet |
| AES-NI | ✓ | ✗ |
| Systèmes d'exploitation | Windows 10, Windows 11, Linux | Android, Windows 10/11 (ARM) |
| Jeu d'instructions | x86-64 (64 bit) | Armv9-A (64 bit) |
| Extensions ISA | SSE4.1, SSE4.2, AVX, AVX2 | |
| Date de sortie | Q1/2023 | Q4/2023 |
| Prix de sortie | 190 $ | |
| Documents | Fiche technique | Fiche technique |