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Intel Core i7-13700H vs MediaTek Dimensity 9300+
Dernière mise à jour:
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Wischen
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Intel Core i7-13700H | MediaTek Dimensity 9300+ |
|---|---|---|
| Famille | Intel Core i7 (300) | Mediatek Dimensity (38) |
| Groupe de processeurs | Intel Core i 13000H (26) | MediaTek Dimensity 9300 (2) |
| Architecture | Raptor Lake H | Cortex-X4 / -A720 |
| La technologie | 10 nm | 4 nm |
| Segment | Notebook | Smartphone / Tablet |
| Socket | BGA 1744 | |
| Prédécesseur | Intel Core i7-12700H | MediaTek Dimensity 9300 |
| Successeur |
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Wischen
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Intel Core i7-13700H | MediaTek Dimensity 9300+ |
|---|---|---|
| CPU Cores / Threads | 14 / 20 | 8 / 8 |
| Hyperthreading / SMT | ✓ | ✗ |
| Architecture de base | hybrid (big.LITTLE) | hybrid (big.LITTLE) |
| Core Cluster 1: | 6x Raptor Cove 2.40 - 5.00 GHz |
1x Cortex-X4 3.40 GHz |
| Core Cluster 2: | 8x Gracemont 1.80 - 3.70 GHz |
3x Cortex-X4 2.85 GHz |
| Core Cluster 3: | 4x Cortex-A720 1.60 - 2.00 GHz |
|
| L2-Cache | ||
| L3-Cache | 24.00 MB | 18.00 MB |
| Overclocking | ✗ | ✗ |
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Wischen
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Intel Core i7-13700H | MediaTek Dimensity 9300+ |
|---|---|---|
| Nom du GPU | Intel Iris Xe Graphics 96 (Alder Lake) | ARM Immortalis-G720 MC12 |
| Fréquence GPU | 0.40 - 1.50 GHz | 1.00 GHz |
| CUs / Shader | 96 / 768 | 12 / |
| Raytracing | ✗ | ✗ |
| Max. affiche | 4 | 0 |
| Max. GPU Mémoire | 32 Go | |
| La technologie | 10 nm | 4 nm |
| Date de sortie | Q1/2022 | Q4/2023 |
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Wischen
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Intel Core i7-13700H | MediaTek Dimensity 9300+ |
|---|---|---|
| Matériel AI | Mediatek APU | |
| Spécifications de l'IA | MediaTek APU 790 @ 33 TOPS | |
| NPU + CPU + iGPU |
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Wischen
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Intel Core i7-13700H | MediaTek Dimensity 9300+ |
|---|---|---|
| Mémoire | LPDDR5-6400 (102.4 Go/s) DDR5-5200 (83.2 Go/s) LPDDR4X-4266 (68.2 Go/s) DDR4-3200 (51.2 Go/s) | LPDDR5X-9600 (76.8 Go/s) |
| Max. Mémoire | 96 Go | 16 Go |
| Canaux de mémoire | 2 | 4 |
| ECC | Oui | Non |
| PCIe | 5.0 x 28 | |
| PCIe Bande passante | 110.3 Go/s |
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Wischen
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Intel Core i7-13700H | MediaTek Dimensity 9300+ |
|---|---|---|
| TDP | 45 W | 12.5 W |
| TDP (PL2) | 115 W | |
| TDP up | ||
| TDP down | 35 W | |
| T. junction max. | 100 °C |
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Wischen
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Intel Core i7-13700H | MediaTek Dimensity 9300+ |
|---|---|---|
| Conception de puce | Monolithique | Chiplet |
| AES-NI | ✓ | ✗ |
| Systèmes d'exploitation | Windows 10, Windows 11, Linux | Android |
| Jeu d'instructions | x86-64 (64 bit) | Armv9-A (64 bit) |
| Extensions ISA | SSE4.1, SSE4.2, AVX2, AVX2+ | |
| Date de sortie | Q1/2023 | Q4/2023 |
| Prix de sortie | 502 $ | |
| Documents | Fiche technique |