MediaTek Dimensity 9000 | Qualcomm Snapdragon 870 | |
CPU comparisonIn this CPU comparison, we compare the MediaTek Dimensity 9000 and the Qualcomm Snapdragon 870 and use benchmarks to check which processor is faster.
We compare the MediaTek Dimensity 9000 8 core processor released in Q1/2022 with the Qualcomm Snapdragon 870 which has 8 CPU cores and was introduced in Q2/2021. |
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Mediatek Dimensity (36) | Family | Qualcomm Snapdragon (102) |
MediaTek Dimensity 9000 (2) | CPU group | Qualcomm Snapdragon 865/870 (3) |
3 | Generation | 7 |
Cortex-X2 / -A710 / -A510 | Architecture | Kryo 585 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe MediaTek Dimensity 9000 is a 8 core processor with a clock frequency of 3.05 GHz. The processor can compute 8 threads at the same time. The Qualcomm Snapdragon 870 clocks with 3.20 GHz, has 8 CPU cores and can calculate 8 threads in parallel. |
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MediaTek Dimensity 9000 | Characteristic | Qualcomm Snapdragon 870 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (Prime / big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
3.05 GHz 1x Cortex-X2 |
A-Core | 3.20 GHz 1x Kryo 585 Prime |
2.85 GHz 3x Cortex-A710 |
B-Core | 2.42 GHz 3x Kryo 585 Gold |
1.80 GHz 4x Cortex-A510 |
C-Core | 1.80 GHz 4x Kryo 585 Silver |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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MediaTek Dimensity 9000 | Characteristic | Qualcomm Snapdragon 870 |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon 698 @ 15 TOPS |
Internal GraphicsGraphics (iGPU) integrated into the processor not only enable image output without having to rely on a dedicated graphics solution, but can also efficiently accelerate video playback. |
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ARM Mali-G710 MP10 | GPU | Qualcomm Adreno 650 |
0.85 GHz | GPU frequency | 0.25 GHz |
-- | GPU (Turbo) | 0.67 GHz |
Vallhall 3 | GPU Generation | 6 |
4 nm | Technology | 7 nm |
1 | Max. displays | 1 |
10 | Compute units | 2 |
-- | Shader | 512 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | -- |
12 | DirectX Version | 12.0 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G710 MP10 | GPU | Qualcomm Adreno 650 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeUp to 16 GB of memory in a maximum of 4 memory channels is supported by the MediaTek Dimensity 9000, while the Qualcomm Snapdragon 870 supports a maximum of 16 GB of memory with a maximum memory bandwidth of 44.0 GB/s enabled. |
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MediaTek Dimensity 9000 | Characteristic | Qualcomm Snapdragon 870 |
LPDDR5X-7500 | Memory | LPDDR5-5500, LPDDR4X-4266 |
16 GB | Max. Memory | 16 GB |
4 (Quad Channel) | Memory channels | 4 (Quad Channel) |
60.0 GB/s | Max. Bandwidth | 44.0 GB/s |
No | ECC | No |
-- | L2 Cache | 2.00 MB |
-- | L3 Cache | 7.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe MediaTek Dimensity 9000 has a TDP of --. The TDP of the Qualcomm Snapdragon 870 is 10 W. System integrators use the TDP of the processor as a guide when dimensioning the cooling solution. |
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MediaTek Dimensity 9000 | Characteristic | Qualcomm Snapdragon 870 |
-- | TDP (PL1 / PBP) | 10 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe MediaTek Dimensity 9000 has 0.00 MB cache and is manufactured in 4 nm. The cache of Qualcomm Snapdragon 870 is at 9.00 MB. The processor is manufactured in 7 nm. |
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MediaTek Dimensity 9000 | Characteristic | Qualcomm Snapdragon 870 |
4 nm | Technology | 7 nm |
Chiplet | Chip design | Chiplet |
Armv9-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q1/2022 | Release date | Q2/2021 |
-- | Release price | -- |
show more data | show more data | |
MediaTek Dimensity 9000
8C 8T @ 3.05 GHz |
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Qualcomm Snapdragon 870
8C 8T @ 3.20 GHz |
MediaTek Dimensity 9000
8C 8T @ 3.05 GHz |
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Qualcomm Snapdragon 870
8C 8T @ 3.20 GHz |
MediaTek Dimensity 9000
ARM Mali-G710 MP10 @ 0.85 GHz |
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Qualcomm Snapdragon 870
Qualcomm Adreno 650 @ 0.67 GHz |
MediaTek Dimensity 9000
8C 8T @ 3.05 GHz |
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Qualcomm Snapdragon 870
8C 8T @ 3.20 GHz |
MediaTek Dimensity 9000
8C 8T @ 3.05 GHz |
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Qualcomm Snapdragon 870
8C 8T @ 3.20 GHz |
MediaTek Dimensity 9000
8C 8T @ 3.05 GHz |
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Qualcomm Snapdragon 870
8C 8T @ 3.20 GHz |
MediaTek Dimensity 9000
8C 8T @ 3.05 GHz |
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Qualcomm Snapdragon 870
8C 8T @ 3.20 GHz |
MediaTek Dimensity 9000
8C 8T @ 3.05 GHz |
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Qualcomm Snapdragon 870
8C 8T @ 3.20 GHz |
MediaTek Dimensity 9000
8C 8T @ 3.05 GHz |
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Qualcomm Snapdragon 870
8C 8T @ 3.20 GHz |
Devices using this processor |
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MediaTek Dimensity 9000 | Qualcomm Snapdragon 870 |
Unknown | Unknown |