MediaTek Dimensity 8100 | Qualcomm Snapdragon 778G | |
CPU comparisonMediaTek Dimensity 8100 or Qualcomm Snapdragon 778G - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The MediaTek Dimensity 8100 has 8 cores with 8 threads and clocks with a maximum frequency of 2.85 GHz. Up to 16 GB of memory is supported in 4 memory channels. The MediaTek Dimensity 8100 was released in Q1/2022. The Qualcomm Snapdragon 778G has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. The CPU supports up to 16 GB of memory in 2 memory channels. The Qualcomm Snapdragon 778G was released in Q2/2021. |
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Mediatek Dimensity (36) | Family | Qualcomm Snapdragon (102) |
MediaTek Dimensity 8000 (4) | CPU group | Qualcomm Snapdragon 778 (2) |
3 | Generation | 4 |
Cortex-A78 / Cortex-A55 | Architecture | Kryo 670 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe MediaTek Dimensity 8100 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the MediaTek Dimensity 8100 is 2.85 GHz while the Qualcomm Snapdragon 778G has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 778G is at 2.40 GHz. |
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MediaTek Dimensity 8100 | Characteristic | Qualcomm Snapdragon 778G |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (Prime / big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.85 GHz 4x Cortex-A78 |
A-Core | 2.40 GHz 1x Kryo 670 Prime |
2.00 GHz 4x Cortex-A55 |
B-Core | 2.20 GHz 3x Kryo 670 Gold |
-- | C-Core | 1.90 GHz 4x Kryo 670 Silver |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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MediaTek Dimensity 8100 | Characteristic | Qualcomm Snapdragon 778G |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon 770 @ 12 TOPS |
Internal GraphicsThe MediaTek Dimensity 8100 or Qualcomm Snapdragon 778G has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G610 MP6 | GPU | Qualcomm Adreno 642L |
GPU frequency | -- | |
-- | GPU (Turbo) | -- |
Vallhall 3 | GPU Generation | 5 |
4 nm | Technology | 6 nm |
1 | Max. displays | 1 |
6 | Compute units | 4 |
-- | Shader | 384 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 4 GB |
12 | DirectX Version | 12.0 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G610 MP6 | GPU | Qualcomm Adreno 642L |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe MediaTek Dimensity 8100 can use up to 16 GB of memory in 4 memory channels. The maximum memory bandwidth is 51.2 GB/s. The Qualcomm Snapdragon 778G supports up to 16 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 51.2 GB/s. |
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MediaTek Dimensity 8100 | Characteristic | Qualcomm Snapdragon 778G |
LPDDR5-6400 | Memory | LPDDR5-6400 |
16 GB | Max. Memory | 16 GB |
4 (Quad Channel) | Memory channels | 2 (Dual Channel) |
51.2 GB/s | Max. Bandwidth | 51.2 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | 2.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the MediaTek Dimensity 8100 is --, while the Qualcomm Snapdragon 778G has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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MediaTek Dimensity 8100 | Characteristic | Qualcomm Snapdragon 778G |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe MediaTek Dimensity 8100 is manufactured in 5 nm and has 0.00 MB cache. The Qualcomm Snapdragon 778G is manufactured in 6 nm and has a 2.00 MB cache. |
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MediaTek Dimensity 8100 | Characteristic | Qualcomm Snapdragon 778G |
5 nm | Technology | 6 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q1/2022 | Release date | Q2/2021 |
-- | Release price | -- |
show more data | show more data | |
MediaTek Dimensity 8100
8C 8T @ 2.85 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
MediaTek Dimensity 8100
8C 8T @ 2.85 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
MediaTek Dimensity 8100
8C 8T @ 2.85 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
MediaTek Dimensity 8100
8C 8T @ 2.85 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
MediaTek Dimensity 8100
8C 8T @ 2.85 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
MediaTek Dimensity 8100
8C 8T @ 2.85 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
MediaTek Dimensity 8100
8C 8T @ 2.85 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
MediaTek Dimensity 8100
8C 8T @ 2.85 GHz |
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Qualcomm Snapdragon 778G
8C 8T @ 2.40 GHz |
Devices using this processor |
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MediaTek Dimensity 8100 | Qualcomm Snapdragon 778G |
Unknown | Samsung Galaxy A73 5G Xiaomi Civi S1 Oppo Reno7 5G |