HiSilicon Kirin 820E 5G | Qualcomm Snapdragon 765G | |
CPU comparisonHiSilicon Kirin 820E 5G or Qualcomm Snapdragon 765G - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 820E 5G has 8 cores with 8 threads and clocks with a maximum frequency of 2.22 GHz. Up to GB of memory is supported in 4 memory channels. The HiSilicon Kirin 820E 5G was released in Q1/2021. The Qualcomm Snapdragon 765G has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. The CPU supports up to 12 GB of memory in 2 memory channels. The Qualcomm Snapdragon 765G was released in Q3/2020. |
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HiSilicon Kirin (29) | Family | Qualcomm Snapdragon (102) |
HiSilicon Kirin 810/820 (3) | CPU group | Qualcomm Snapdragon 760 (3) |
6 | Generation | 3 |
Cortex-A76 / Cortex-A55 | Architecture | Kryo 475 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 820E 5G is a 8 core processor with a clock frequency of 2.22 GHz. The Qualcomm Snapdragon 765G has 8 CPU cores with a clock frequency of 2.40 GHz. |
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HiSilicon Kirin 820E 5G | Characteristic | Qualcomm Snapdragon 765G |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.22 GHz 3x Cortex-A76 |
A-Core | 2.40 GHz 1x Kryo 475 Prime |
1.84 GHz 3x Cortex-A55 |
B-Core | 2.20 GHz 1x Kryo 475 Gold |
-- | C-Core | 1.80 GHz 6x Kryo 475 Silver |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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HiSilicon Kirin 820E 5G | Characteristic | Qualcomm Snapdragon 765G |
HUAWEI HiAI 2.0 | AI hardware | Qualcomm AI engine |
Da Vinci Architecture. Ascend D110 Lite | AI specifications | Hexagon 696 @ 5.5 TOPS |
Internal GraphicsThe integrated graphics unit of a processor is not only responsible for the pure image output on the system, but can also significantly increase the efficiency of the system with the support of modern video codecs. |
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ARM Mali-G57 MP6 | GPU | Qualcomm Adreno 620 |
0.85 GHz | GPU frequency | 0.75 GHz |
-- | GPU (Turbo) | -- |
Vallhall 1 | GPU Generation | 6 |
7 nm | Technology | 7 nm |
2 | Max. displays | 2 |
6 | Compute units | -- |
96 | Shader | 192 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | 4 GB |
12 | DirectX Version | 12.1 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G57 MP6 | GPU | Qualcomm Adreno 620 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 820E 5G supports a maximum of GB of memory in 4 memory channels. The Qualcomm Snapdragon 765G can connect up to 12 GB of memory in 2 memory channels. |
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HiSilicon Kirin 820E 5G | Characteristic | Qualcomm Snapdragon 765G |
LPDDR4X-2133 | Memory | LPDDR4-4266 |
Max. Memory | 12 GB | |
4 (Quad Channel) | Memory channels | 2 (Dual Channel) |
-- | Max. Bandwidth | 17.1 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
2.00 MB | L3 Cache | 2.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe TDP (Thermal Design Power) of a processor specifies the required cooling solution. The HiSilicon Kirin 820E 5G has a TDP of 6 W, that of the Qualcomm Snapdragon 765G is 5 W. |
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HiSilicon Kirin 820E 5G | Characteristic | Qualcomm Snapdragon 765G |
6 W | TDP (PL1 / PBP) | 5 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 820E 5G has a 2.00 MB cache, while the Qualcomm Snapdragon 765G cache has a total of 2.00 MB. |
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HiSilicon Kirin 820E 5G | Characteristic | Qualcomm Snapdragon 765G |
7 nm | Technology | 7 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q1/2021 | Release date | Q3/2020 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 820E 5G
ARM Mali-G57 MP6 @ 0.85 GHz |
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Qualcomm Snapdragon 765G
Qualcomm Adreno 620 @ 0.75 GHz |
HiSilicon Kirin 820E 5G
8C 8T @ 2.22 GHz |
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Qualcomm Snapdragon 765G
8C 8T @ 2.40 GHz |
HiSilicon Kirin 820E 5G
8C 8T @ 2.22 GHz |
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Qualcomm Snapdragon 765G
8C 8T @ 2.40 GHz |
HiSilicon Kirin 820E 5G
8C 8T @ 2.22 GHz |
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Qualcomm Snapdragon 765G
8C 8T @ 2.40 GHz |
HiSilicon Kirin 820E 5G
8C 8T @ 2.22 GHz |
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Qualcomm Snapdragon 765G
8C 8T @ 2.40 GHz |
HiSilicon Kirin 820E 5G
8C 8T @ 2.22 GHz |
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Qualcomm Snapdragon 765G
8C 8T @ 2.40 GHz |
HiSilicon Kirin 820E 5G
8C 8T @ 2.22 GHz |
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Qualcomm Snapdragon 765G
8C 8T @ 2.40 GHz |
HiSilicon Kirin 820E 5G
8C 8T @ 2.22 GHz |
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Qualcomm Snapdragon 765G
8C 8T @ 2.40 GHz |
Devices using this processor |
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HiSilicon Kirin 820E 5G | Qualcomm Snapdragon 765G |
Huawei Nova 7 SE Huawei Nova 8 |
Unknown |