Samsung Exynos 7870 | HiSilicon Kirin 810 | |
CPU comparisonSamsung Exynos 7870 or HiSilicon Kirin 810 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The Samsung Exynos 7870 has 8 cores with 8 threads and clocks with a maximum frequency of 1.60 GHz. Up to GB of memory is supported in 0 memory channels. The Samsung Exynos 7870 was released in Q1/2016. The HiSilicon Kirin 810 has 8 cores with 8 threads and clocks with a maximum frequency of 2.20 GHz. The CPU supports up to 6 GB of memory in 4 memory channels. The HiSilicon Kirin 810 was released in Q2/2019. |
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Samsung Exynos (46) | Family | HiSilicon Kirin (29) |
Samsung Exynos 7570/7870/7880 (4) | CPU group | HiSilicon Kirin 810/820 (3) |
1 | Generation | 6 |
Cortex-A53 | Architecture | Cortex-A76 / Cortex-A55 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe Samsung Exynos 7870 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the Samsung Exynos 7870 is 1.60 GHz while the HiSilicon Kirin 810 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the HiSilicon Kirin 810 is at 2.20 GHz. |
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Samsung Exynos 7870 | Characteristic | HiSilicon Kirin 810 |
8 | Cores | 8 |
8 | Threads | 8 |
normal | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
1.60 GHz 8x Cortex-A53 |
A-Core | 2.20 GHz 2x Cortex-A76 |
-- | B-Core | 1.90 GHz 6x Cortex-A55 |
Internal GraphicsThe Samsung Exynos 7870 or HiSilicon Kirin 810 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-T830 MP1 | GPU | ARM Mali-G52 MP6 |
0.60 GHz | GPU frequency | 0.85 GHz |
0.60 GHz | GPU (Turbo) | -- |
Midgard 4 | GPU Generation | Bifrost 2 |
28nm | Technology | 12 nm |
2 | Max. displays | 2 |
1 | Compute units | 16 |
16 | Shader | 288 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 4 GB |
11 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-T830 MP1 | GPU | ARM Mali-G52 MP6 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
No | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
No | Codec AV1 | No |
No | Codec AVC | Decode / Encode |
No | Codec VC-1 | Decode / Encode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe Samsung Exynos 7870 can use up to GB of memory in 0 memory channels. The maximum memory bandwidth is --. The HiSilicon Kirin 810 supports up to 6 GB of memory in 4 memory channels and achieves a memory bandwidth of up to --. |
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Samsung Exynos 7870 | Characteristic | HiSilicon Kirin 810 |
LPDDR3-933 | Memory | LPDDR4X-2133 |
Max. Memory | 6 GB | |
0 | Memory channels | 4 (Quad Channel) |
-- | Max. Bandwidth | -- |
No | ECC | No |
2.00 MB | L2 Cache | -- |
-- | L3 Cache | 1.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the Samsung Exynos 7870 is --, while the HiSilicon Kirin 810 has a TDP of 5 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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Samsung Exynos 7870 | Characteristic | HiSilicon Kirin 810 |
-- | TDP (PL1 / PBP) | 5 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Samsung Exynos 7870 is manufactured in 14 nm and has 2.00 MB cache. The HiSilicon Kirin 810 is manufactured in 7 nm and has a 1.00 MB cache. |
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Samsung Exynos 7870 | Characteristic | HiSilicon Kirin 810 |
14 nm | Technology | 7 nm |
Unknown | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q1/2016 | Release date | Q2/2019 |
-- | Release price | -- |
show more data | show more data | |
Samsung Exynos 7870
8C 8T @ 1.60 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Samsung Exynos 7870
8C 8T @ 1.60 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Samsung Exynos 7870
ARM Mali-T830 MP1 @ 0.60 GHz |
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HiSilicon Kirin 810
ARM Mali-G52 MP6 @ 0.85 GHz |
Samsung Exynos 7870
8C 8T @ 1.60 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Samsung Exynos 7870
8C 8T @ 1.60 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Samsung Exynos 7870
8C 8T @ 1.60 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Samsung Exynos 7870
8C 8T @ 1.60 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Samsung Exynos 7870
8C 8T @ 1.60 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Devices using this processor |
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Samsung Exynos 7870 | HiSilicon Kirin 810 |
Unknown | Huawei Honor 9X Pro Huawei Honor Play 4T Pro Huawei MatePad 10.4 Huawei Nova 5i Pro Huawei P40 Lite |