Qualcomm Snapdragon 712 | HiSilicon Kirin 810 | |
CPU comparisonQualcomm Snapdragon 712 or HiSilicon Kirin 810 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The Qualcomm Snapdragon 712 has 8 cores with 8 threads and clocks with a maximum frequency of 2.30 GHz. Up to 8 GB of memory is supported in 2 memory channels. The Qualcomm Snapdragon 712 was released in Q1/2019. The HiSilicon Kirin 810 has 8 cores with 8 threads and clocks with a maximum frequency of 2.20 GHz. The CPU supports up to 6 GB of memory in 4 memory channels. The HiSilicon Kirin 810 was released in Q2/2019. |
||
Qualcomm Snapdragon (102) | Family | HiSilicon Kirin (29) |
Qualcomm Snapdragon 710 (2) | CPU group | HiSilicon Kirin 810/820 (3) |
1 | Generation | 6 |
Kryo 360 | Architecture | Cortex-A76 / Cortex-A55 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
|
||
CPU Cores and Base FrequencyThe Qualcomm Snapdragon 712 is a 8 core processor with a clock frequency of 2.30 GHz. The HiSilicon Kirin 810 has 8 CPU cores with a clock frequency of 2.20 GHz. |
||
Qualcomm Snapdragon 712 | Characteristic | HiSilicon Kirin 810 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.30 GHz 2x Kryo 360 Gold |
A-Core | 2.20 GHz 2x Cortex-A76 |
1.70 GHz 6x Kryo 360 Silver |
B-Core | 1.90 GHz 6x Cortex-A55 |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
||
Qualcomm Snapdragon 712 | Characteristic | HiSilicon Kirin 810 |
Qualcomm AI engine | AI hardware | -- |
Hexagon 685 @ 3 TOPS | AI specifications | -- |
Internal GraphicsThe integrated graphics unit of a processor is not only responsible for the pure image output on the system, but can also significantly increase the efficiency of the system with the support of modern video codecs. |
||
Qualcomm Adreno 616 | GPU | ARM Mali-G52 MP6 |
0.75 GHz | GPU frequency | 0.85 GHz |
0.75 GHz | GPU (Turbo) | -- |
6 | GPU Generation | Bifrost 2 |
10 nm | Technology | 12 nm |
0 | Max. displays | 2 |
-- | Compute units | 16 |
256 | Shader | 288 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 4 GB |
12.1 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
||
Qualcomm Adreno 616 | GPU | ARM Mali-G52 MP6 |
Decode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode | Codec h264 | Decode / Encode |
Decode | Codec VP9 | Decode / Encode |
Decode | Codec VP8 | Decode / Encode |
No | Codec AV1 | No |
Decode | Codec AVC | Decode / Encode |
Decode | Codec VC-1 | Decode / Encode |
Decode | Codec JPEG | Decode / Encode |
Memory & PCIeThe Qualcomm Snapdragon 712 supports a maximum of 8 GB of memory in 2 memory channels. The HiSilicon Kirin 810 can connect up to 6 GB of memory in 4 memory channels. |
||
Qualcomm Snapdragon 712 | Characteristic | HiSilicon Kirin 810 |
LPDDR4X-3733 | Memory | LPDDR4X-2133 |
8 GB | Max. Memory | 6 GB |
2 (Dual Channel) | Memory channels | 4 (Quad Channel) |
14.9 GB/s | Max. Bandwidth | -- |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | 1.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe TDP (Thermal Design Power) of a processor specifies the required cooling solution. The Qualcomm Snapdragon 712 has a TDP of --, that of the HiSilicon Kirin 810 is 5 W. |
||
Qualcomm Snapdragon 712 | Characteristic | HiSilicon Kirin 810 |
-- | TDP (PL1 / PBP) | 5 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Qualcomm Snapdragon 712 has a 0.00 MB cache, while the HiSilicon Kirin 810 cache has a total of 1.00 MB. |
||
Qualcomm Snapdragon 712 | Characteristic | HiSilicon Kirin 810 |
10 nm | Technology | 7 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q1/2019 | Release date | Q2/2019 |
-- | Release price | -- |
show more data | show more data | |
Qualcomm Snapdragon 712
8C 8T @ 2.30 GHz |
|||
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Qualcomm Snapdragon 712
8C 8T @ 2.30 GHz |
|||
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Qualcomm Snapdragon 712
8C 8T @ 2.30 GHz |
|||
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Qualcomm Snapdragon 712
8C 8T @ 2.30 GHz |
|||
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Qualcomm Snapdragon 712
Qualcomm Adreno 616 @ 0.75 GHz |
|||
HiSilicon Kirin 810
ARM Mali-G52 MP6 @ 0.85 GHz |
Qualcomm Snapdragon 712
8C 8T @ 2.30 GHz |
|||
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Qualcomm Snapdragon 712
8C 8T @ 2.30 GHz |
|||
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Qualcomm Snapdragon 712
8C 8T @ 2.30 GHz |
|||
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Qualcomm Snapdragon 712
8C 8T @ 2.30 GHz |
|||
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Devices using this processor |
|
Qualcomm Snapdragon 712 | HiSilicon Kirin 810 |
Unknown | Huawei Honor 9X Pro Huawei Honor Play 4T Pro Huawei MatePad 10.4 Huawei Nova 5i Pro Huawei P40 Lite |