Qualcomm Snapdragon 662 | HiSilicon Kirin 970 | |
CPU comparisonQualcomm Snapdragon 662 or HiSilicon Kirin 970 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The Qualcomm Snapdragon 662 has 8 cores with 8 threads and clocks with a maximum frequency of 2.00 GHz. Up to 8 GB of memory is supported in 2 memory channels. The Qualcomm Snapdragon 662 was released in Q1/2020. The HiSilicon Kirin 970 has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. The CPU supports up to 8 GB of memory in 4 memory channels. The HiSilicon Kirin 970 was released in Q3/2017. |
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Qualcomm Snapdragon (102) | Family | HiSilicon Kirin (29) |
Qualcomm Snapdragon 662/665 (2) | CPU group | HiSilicon Kirin 970 (1) |
7 | Generation | 6 |
Kryo 260 | Architecture | Cortex-A73 / Cortex-A53 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe Qualcomm Snapdragon 662 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the Qualcomm Snapdragon 662 is 2.00 GHz while the HiSilicon Kirin 970 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the HiSilicon Kirin 970 is at 2.40 GHz. |
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Qualcomm Snapdragon 662 | Characteristic | HiSilicon Kirin 970 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.00 GHz 4x Kryo 260 Gold |
A-Core | 2.40 GHz 4x Cortex-A73 |
1.80 GHz 4x Kryo 260 Silver |
B-Core | 1.84 GHz 4x Cortex-A53 |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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Qualcomm Snapdragon 662 | Characteristic | HiSilicon Kirin 970 |
Qualcomm AI engine | AI hardware | -- |
Hexagon 683 | AI specifications | -- |
Internal GraphicsThe Qualcomm Snapdragon 662 or HiSilicon Kirin 970 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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Qualcomm Adreno 610 | GPU | ARM Mali-G72 MP12 |
GPU frequency | 0.75 GHz | |
-- | GPU (Turbo) | -- |
6 | GPU Generation | Bifrost 2 |
11 nm | Technology | 16 nm |
0 | Max. displays | 1 |
-- | Compute units | 12 |
128 | Shader | 192 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | 2 GB |
12.1 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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Qualcomm Adreno 610 | GPU | ARM Mali-G72 MP12 |
Decode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode | Codec VP9 | Decode / Encode |
Decode | Codec VP8 | Decode / Encode |
No | Codec AV1 | No |
Decode | Codec AVC | Decode / Encode |
Decode | Codec VC-1 | Decode / Encode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe Qualcomm Snapdragon 662 can use up to 8 GB of memory in 2 memory channels. The maximum memory bandwidth is 29.8 GB/s. The HiSilicon Kirin 970 supports up to 8 GB of memory in 4 memory channels and achieves a memory bandwidth of up to --. |
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Qualcomm Snapdragon 662 | Characteristic | HiSilicon Kirin 970 |
LPDDR4X-3733, LPDDR3-1866 | Memory | LPDDR4X-2133 |
8 GB | Max. Memory | 8 GB |
2 (Dual Channel) | Memory channels | 4 (Quad Channel) |
29.8 GB/s | Max. Bandwidth | -- |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | 2.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the Qualcomm Snapdragon 662 is --, while the HiSilicon Kirin 970 has a TDP of 9 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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Qualcomm Snapdragon 662 | Characteristic | HiSilicon Kirin 970 |
-- | TDP (PL1 / PBP) | 9 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Qualcomm Snapdragon 662 is manufactured in 11 nm and has 0.00 MB cache. The HiSilicon Kirin 970 is manufactured in 10 nm and has a 2.00 MB cache. |
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Qualcomm Snapdragon 662 | Characteristic | HiSilicon Kirin 970 |
11 nm | Technology | 10 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q1/2020 | Release date | Q3/2017 |
-- | Release price | -- |
show more data | show more data | |
Qualcomm Snapdragon 662
8C 8T @ 2.00 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
Qualcomm Snapdragon 662
8C 8T @ 2.00 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
Qualcomm Snapdragon 662
Qualcomm Adreno 610 @ 0.00 GHz |
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HiSilicon Kirin 970
ARM Mali-G72 MP12 @ 0.75 GHz |
Qualcomm Snapdragon 662
8C 8T @ 2.00 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
Qualcomm Snapdragon 662
8C 8T @ 2.00 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
Qualcomm Snapdragon 662
8C 8T @ 2.00 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
Qualcomm Snapdragon 662
8C 8T @ 2.00 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
Qualcomm Snapdragon 662
8C 8T @ 2.00 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
Devices using this processor |
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Qualcomm Snapdragon 662 | HiSilicon Kirin 970 |
Unknown | Huawei Honor 10 Huawei Note 10 Huawei Play Huawei Honor View 10 Huawei Mate 10 Pro Huawei P20 Huawei Nova 3 Huawei Nova 4 |