Qualcomm Snapdragon 212 vs HiSilicon Kirin 925

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CPU comparison with benchmarks


Qualcomm Snapdragon 212 CPU1 vs CPU2 HiSilicon Kirin 925
Qualcomm Snapdragon 212 HiSilicon Kirin 925

CPU comparison

Qualcomm Snapdragon 212 or HiSilicon Kirin 925 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.

The Qualcomm Snapdragon 212 has 4 cores with 4 threads and clocks with a maximum frequency of 1.30 GHz. Up to 4 GB of memory is supported in 1 memory channels. The Qualcomm Snapdragon 212 was released in 2015.

The HiSilicon Kirin 925 has 8 cores with 8 threads and clocks with a maximum frequency of 1.80 GHz. The CPU supports up to GB of memory in 2 memory channels. The HiSilicon Kirin 925 was released in Q3/2014.
Qualcomm Snapdragon (102) Family HiSilicon Kirin (29)
Qualcomm Snapdragon 205-212 (4) CPU group HiSilicon Kirin 920 (3)
2 Generation 2
Cortex-A7 Architecture Cortex-A15 / Cortex-A7
Mobile Segment Mobile
-- Predecessor --
-- Successor --

CPU Cores and Base Frequency

The Qualcomm Snapdragon 212 has 4 CPU cores and can calculate 4 threads in parallel. The clock frequency of the Qualcomm Snapdragon 212 is 1.30 GHz while the HiSilicon Kirin 925 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the HiSilicon Kirin 925 is at 1.80 GHz.

Qualcomm Snapdragon 212 Characteristic HiSilicon Kirin 925
4 Cores 8
4 Threads 8
normal Core architecture hybrid (big.LITTLE)
No Hyperthreading No
No Overclocking ? No
1.30 GHz
4x Cortex-A7
A-Core 1.80 GHz
4x Cortex-A15
-- B-Core 1.30 GHz
4x Cortex-A7

Artificial Intelligence and Machine Learning

Processors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor.

Qualcomm Snapdragon 212 Characteristic HiSilicon Kirin 925
Qualcomm AI engine AI hardware --
Hexagon QDSP6 AI specifications --

Internal Graphics

The Qualcomm Snapdragon 212 or HiSilicon Kirin 925 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.

Qualcomm Adreno 304 GPU ARM Mali-T628 MP4
0.40 GHz GPU frequency 0.60 GHz
0.40 GHz GPU (Turbo) 0.60 GHz
3 GPU Generation Midgard 2
28 nm Technology 32nm
0 Max. displays 1
-- Compute units 4
24 Shader 64
No Hardware Raytracing No
No Frame Generation No
-- Max. GPU Memory --
11 DirectX Version 11

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.

Qualcomm Adreno 304 GPU ARM Mali-T628 MP4
Decode Codec h265 / HEVC (8 bit) No
No Codec h265 / HEVC (10 bit) No
Decode / Encode Codec h264 Decode / Encode
No Codec VP9 No
No Codec VP8 Decode / Encode
No Codec AV1 No
No Codec AVC No
Decode Codec VC-1 No
Decode / Encode Codec JPEG No

Memory & PCIe

The Qualcomm Snapdragon 212 can use up to 4 GB of memory in 1 memory channels. The maximum memory bandwidth is 4.3 GB/s. The HiSilicon Kirin 925 supports up to GB of memory in 2 memory channels and achieves a memory bandwidth of up to --.

Qualcomm Snapdragon 212 Characteristic HiSilicon Kirin 925
LPDDR3-1066, LPDDR2-1066 Memory LPDDR3-1600
4 GB Max. Memory
1 (Single Channel) Memory channels 2 (Dual Channel)
4.3 GB/s Max. Bandwidth --
No ECC No
-- L2 Cache --
-- L3 Cache --
-- PCIe version --
-- PCIe lanes --
-- PCIe Bandwidth --

Thermal Management

The thermal design power (TDP for short) of the Qualcomm Snapdragon 212 is --, while the HiSilicon Kirin 925 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently.

Qualcomm Snapdragon 212 Characteristic HiSilicon Kirin 925
-- TDP (PL1 / PBP) --
-- TDP (PL2) --
-- TDP up --
-- TDP down --
-- Tjunction max. --

Technical details

The Qualcomm Snapdragon 212 is manufactured in 28 nm and has 0.00 MB cache. The HiSilicon Kirin 925 is manufactured in 28 nm and has a 0.00 MB cache.

Qualcomm Snapdragon 212 Characteristic HiSilicon Kirin 925
28 nm Technology 28 nm
Chiplet Chip design Chiplet
Armv7-A (32 bit) Instruction set (ISA) Armv7-A (32 bit)
-- ISA extensions --
-- Socket --
None Virtualization None
No AES-NI No
Android Operating systems Android
2015 Release date Q3/2014
-- Release price --
show more data show more data


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iGPU - FP32 Performance (Single-precision GFLOPS)

The theoretical computing performance of the internal graphics unit of the processor with simple accuracy (32 bit) in GFLOPS. GFLOPS indicates how many billion floating point operations the iGPU can perform per second.
Qualcomm Snapdragon 212 Qualcomm Snapdragon 212
Qualcomm Adreno 304 @ 0.40 GHz
19 (25%)
HiSilicon Kirin 925 HiSilicon Kirin 925
ARM Mali-T628 MP4 @ 0.60 GHz
77 (100%)

Devices using this processor

Qualcomm Snapdragon 212 HiSilicon Kirin 925
Unknown Unknown

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