MediaTek Helio G70 | Qualcomm Snapdragon 636 | |
CPU comparisonMediaTek Helio G70 or Qualcomm Snapdragon 636 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The MediaTek Helio G70 has 8 cores with 8 threads and clocks with a maximum frequency of 2.00 GHz. Up to 8 GB of memory is supported in 4 memory channels. The MediaTek Helio G70 was released in Q1/2020. The Qualcomm Snapdragon 636 has 8 cores with 8 threads and clocks with a maximum frequency of 1.80 GHz. The CPU supports up to 8 GB of memory in 2 memory channels. The Qualcomm Snapdragon 636 was released in Q4/2017. |
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Mediatek Helio (37) | Family | Qualcomm Snapdragon (102) |
MediaTek Helio G70/G80 (4) | CPU group | Qualcomm Snapdragon 636 (1) |
1 | Generation | 5 |
Cortex-A75 / Cortex-A55 | Architecture | Kryo 260 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe MediaTek Helio G70 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the MediaTek Helio G70 is 2.00 GHz while the Qualcomm Snapdragon 636 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 636 is at 1.80 GHz. |
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MediaTek Helio G70 | Characteristic | Qualcomm Snapdragon 636 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.00 GHz 2x Cortex-A75 |
A-Core | 1.80 GHz 4x Kryo 260 Gold |
1.70 GHz 6x Cortex-A55 |
B-Core | 1.60 GHz 4x Kryo 260 Silver |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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MediaTek Helio G70 | Characteristic | Qualcomm Snapdragon 636 |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon DSP |
Internal GraphicsThe MediaTek Helio G70 or Qualcomm Snapdragon 636 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G52 MP2 | GPU | Qualcomm Adreno 509 |
0.82 GHz | GPU frequency | 0.72 GHz |
-- | GPU (Turbo) | 0.72 GHz |
Bifrost 2 | GPU Generation | 5 |
16 nm | Technology | 14 nm |
2 | Max. displays | 0 |
2 | Compute units | -- |
32 | Shader | 128 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | -- |
12 | DirectX Version | 12.1 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G52 MP2 | GPU | Qualcomm Adreno 509 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
Decode / Encode | Codec h265 / HEVC (10 bit) | No |
Decode / Encode | Codec h264 | Decode |
Decode / Encode | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode |
No | Codec AV1 | No |
Decode / Encode | Codec AVC | No |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode |
Memory & PCIeThe MediaTek Helio G70 can use up to 8 GB of memory in 4 memory channels. The maximum memory bandwidth is 14.4 GB/s. The Qualcomm Snapdragon 636 supports up to 8 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 10.6 GB/s. |
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MediaTek Helio G70 | Characteristic | Qualcomm Snapdragon 636 |
LPDDR4X-1800 | Memory | |
8 GB | Max. Memory | 8 GB |
4 (Quad Channel) | Memory channels | 2 (Dual Channel) |
14.4 GB/s | Max. Bandwidth | 10.6 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the MediaTek Helio G70 is --, while the Qualcomm Snapdragon 636 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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MediaTek Helio G70 | Characteristic | Qualcomm Snapdragon 636 |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe MediaTek Helio G70 is manufactured in 12 nm and has 0.00 MB cache. The Qualcomm Snapdragon 636 is manufactured in 14 nm and has a 0.00 MB cache. |
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MediaTek Helio G70 | Characteristic | Qualcomm Snapdragon 636 |
12 nm | Technology | 14 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q1/2020 | Release date | Q4/2017 |
-- | Release price | -- |
show more data | show more data | |
MediaTek Helio G70
8C 8T @ 2.00 GHz |
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Qualcomm Snapdragon 636
8C 8T @ 1.80 GHz |
MediaTek Helio G70
8C 8T @ 2.00 GHz |
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Qualcomm Snapdragon 636
8C 8T @ 1.80 GHz |
MediaTek Helio G70
ARM Mali-G52 MP2 @ 0.82 GHz |
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Qualcomm Snapdragon 636
Qualcomm Adreno 509 @ 0.72 GHz |
MediaTek Helio G70
8C 8T @ 2.00 GHz |
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Qualcomm Snapdragon 636
8C 8T @ 1.80 GHz |
MediaTek Helio G70
8C 8T @ 2.00 GHz |
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Qualcomm Snapdragon 636
8C 8T @ 1.80 GHz |
MediaTek Helio G70
8C 8T @ 2.00 GHz |
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Qualcomm Snapdragon 636
8C 8T @ 1.80 GHz |
MediaTek Helio G70
8C 8T @ 2.00 GHz |
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Qualcomm Snapdragon 636
8C 8T @ 1.80 GHz |
Devices using this processor |
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MediaTek Helio G70 | Qualcomm Snapdragon 636 |
Unknown | Unknown |