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MediaTek Dimensity 900 | Qualcomm Snapdragon 860 | |
CPU comparisonMediaTek Dimensity 900 or Qualcomm Snapdragon 860 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The MediaTek Dimensity 900 has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. Up to 16 GB of memory is supported in 4 memory channels. The MediaTek Dimensity 900 was released in Q2/2021. The Qualcomm Snapdragon 860 has 8 cores with 8 threads and clocks with a maximum frequency of 2.96 GHz. The CPU supports up to 16 GB of memory in 4 memory channels. The Qualcomm Snapdragon 860 was released in Q1/2021. |
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Mediatek Dimensity | Family | Qualcomm Snapdragon |
MediaTek Dimensity 900 | CPU group | Qualcomm Snapdragon 855/860 |
2 | Generation | 6 |
Cortex-A78 / Cortex-A55 | Architecture | Kryo 485 |
Mobile | Segment | Mobile |
-- | Predecessor | Qualcomm Snapdragon 855 Plus |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe MediaTek Dimensity 900 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the MediaTek Dimensity 900 is 2.40 GHz while the Qualcomm Snapdragon 860 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 860 is at 2.00 GHz. |
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MediaTek Dimensity 900 | Characteristic | Qualcomm Snapdragon 860 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (Prime / big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.40 GHz 2x Cortex-A78 |
A-Core | 2.96 GHz 1x Kryo 485 Prime |
2.00 GHz 6x Cortex-A55 |
B-Core | 2.42 GHz 3x Kryo 485 Gold |
-- | C-Core | 1.80 GHz 4x Kryo 485 Silver |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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MediaTek Dimensity 900 | Characteristic | Qualcomm Snapdragon 860 |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon 690 @ 7 TOPS |
Internal GraphicsThe MediaTek Dimensity 900 or Qualcomm Snapdragon 860 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G68 MP4 | GPU | Qualcomm Adreno 640 |
0.85 GHz | GPU frequency | 0.25 GHz |
-- | GPU (Turbo) | 0.68 GHz |
Vallhall 2 | GPU Generation | 5 |
6 nm | Technology | 7 nm |
1 | Max. displays | 1 |
4 | Compute units | 4 |
64 | Shader | 384 |
-- | Max. GPU Memory | 4 GB |
12 | DirectX Version | 12.0 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G68 MP4 | GPU | Qualcomm Adreno 640 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | No |
Decode / Encode | Codec VC-1 | No |
Decode / Encode | Codec JPEG | No |
Memory & PCIeThe MediaTek Dimensity 900 can use up to 16 GB of memory in 4 memory channels. The maximum memory bandwidth is 44.0 GB/s. The Qualcomm Snapdragon 860 supports up to 16 GB of memory in 4 memory channels and achieves a memory bandwidth of up to 34.1 GB/s. |
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MediaTek Dimensity 900 | Characteristic | Qualcomm Snapdragon 860 |
LPDDR5-5500, LPDDR4X-4266 | Memory | LPDDR4X-4266 |
16 GB | Max. Memory | 16 GB |
4 (Quad Channel) | Memory channels | 4 (Quad Channel) |
44.0 GB/s | Max. Bandwidth | 34.1 GB/s |
No | ECC | No |
-- | L2 Cache | 2.00 MB |
2.00 MB | L3 Cache | 3.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the MediaTek Dimensity 900 is 10 W, while the Qualcomm Snapdragon 860 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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MediaTek Dimensity 900 | Characteristic | Qualcomm Snapdragon 860 |
10 W | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe MediaTek Dimensity 900 is manufactured in 6 nm and has 2.00 MB cache. The Qualcomm Snapdragon 860 is manufactured in 7 nm and has a 5.00 MB cache. |
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MediaTek Dimensity 900 | Characteristic | Qualcomm Snapdragon 860 |
6 nm | Technology | 7 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q2/2021 | Release date | Q1/2021 |
-- | Release price | -- |
show more data | show more data | |
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MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 860
8C 8T @ 2.96 GHz |
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MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 860
8C 8T @ 2.96 GHz |
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MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 860
8C 8T @ 2.96 GHz |
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MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 860
8C 8T @ 2.96 GHz |
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MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 860
8C 8T @ 2.96 GHz |
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MediaTek Dimensity 900
ARM Mali-G68 MP4 @ 0.85 GHz |
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Qualcomm Snapdragon 860
Qualcomm Adreno 640 @ 0.68 GHz |
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MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 860
8C 8T @ 2.96 GHz |
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MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 860
8C 8T @ 2.96 GHz |
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MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 860
8C 8T @ 2.96 GHz |
Devices using this processor |
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MediaTek Dimensity 900 | Qualcomm Snapdragon 860 |
Unknown | Unknown |