HiSilicon Kirin 9000 | HiSilicon Kirin 810 | |
CPU comparisonHiSilicon Kirin 9000 or HiSilicon Kirin 810 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 9000 has 8 cores with 8 threads and clocks with a maximum frequency of 3.13 GHz. Up to GB of memory is supported in 4 memory channels. The HiSilicon Kirin 9000 was released in Q4/2020. The HiSilicon Kirin 810 has 8 cores with 8 threads and clocks with a maximum frequency of 2.20 GHz. The CPU supports up to 6 GB of memory in 4 memory channels. The HiSilicon Kirin 810 was released in Q2/2019. |
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HiSilicon Kirin (29) | Family | HiSilicon Kirin (29) |
HiSilicon Kirin 9000 (2) | CPU group | HiSilicon Kirin 810/820 (3) |
9 | Generation | 6 |
Cortex-A77 / Cortex-A55 | Architecture | Cortex-A76 / Cortex-A55 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 9000 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 9000 is 3.13 GHz while the HiSilicon Kirin 810 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the HiSilicon Kirin 810 is at 2.20 GHz. |
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HiSilicon Kirin 9000 | Characteristic | HiSilicon Kirin 810 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
3.13 GHz 1x Cortex-A77 |
A-Core | 2.20 GHz 2x Cortex-A76 |
2.54 GHz 3x Cortex-A77 |
B-Core | 1.90 GHz 6x Cortex-A55 |
2.05 GHz 4x Cortex-A55 |
C-Core | -- |
Internal GraphicsThe HiSilicon Kirin 9000 or HiSilicon Kirin 810 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G78 MP24 | GPU | ARM Mali-G52 MP6 |
0.76 GHz | GPU frequency | 0.85 GHz |
-- | GPU (Turbo) | -- |
Vallhall 2 | GPU Generation | Bifrost 2 |
5 nm | Technology | 12 nm |
1 | Max. displays | 2 |
24 | Compute units | 16 |
384 | Shader | 288 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 4 GB |
12 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G78 MP24 | GPU | ARM Mali-G52 MP6 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode / Encode |
Decode / Encode | Codec VC-1 | Decode / Encode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 9000 can use up to GB of memory in 4 memory channels. The maximum memory bandwidth is --. The HiSilicon Kirin 810 supports up to 6 GB of memory in 4 memory channels and achieves a memory bandwidth of up to --. |
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HiSilicon Kirin 9000 | Characteristic | HiSilicon Kirin 810 |
LPDDR5-2750, LPDDR4X-2133 | Memory | LPDDR4X-2133 |
Max. Memory | 6 GB | |
4 (Quad Channel) | Memory channels | 4 (Quad Channel) |
-- | Max. Bandwidth | -- |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | 1.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 9000 is --, while the HiSilicon Kirin 810 has a TDP of 5 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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HiSilicon Kirin 9000 | Characteristic | HiSilicon Kirin 810 |
-- | TDP (PL1 / PBP) | 5 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 9000 is manufactured in 5 nm and has 0.00 MB cache. The HiSilicon Kirin 810 is manufactured in 7 nm and has a 1.00 MB cache. |
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HiSilicon Kirin 9000 | Characteristic | HiSilicon Kirin 810 |
5 nm | Technology | 7 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q4/2020 | Release date | Q2/2019 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
HiSilicon Kirin 9000
ARM Mali-G78 MP24 @ 0.76 GHz |
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HiSilicon Kirin 810
ARM Mali-G52 MP6 @ 0.85 GHz |
HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Devices using this processor |
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HiSilicon Kirin 9000 | HiSilicon Kirin 810 |
Unknown | Huawei Honor 9X Pro Huawei Honor Play 4T Pro Huawei MatePad 10.4 Huawei Nova 5i Pro Huawei P40 Lite |