HiSilicon Kirin 810 vs Qualcomm Snapdragon 625
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CPU comparison with benchmarks
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| HiSilicon Kirin 810 | Qualcomm Snapdragon 625 | |
CPU comparisonHiSilicon Kirin 810 or Qualcomm Snapdragon 625 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 810 has 8 cores with 8 threads and clocks with a maximum frequency of 2.20 GHz. Up to 6 GB of memory is supported in 4 memory channels. The HiSilicon Kirin 810 was released in Q2/2019. The Qualcomm Snapdragon 625 has 8 cores with 8 threads and clocks with a maximum frequency of 2.00 GHz. The CPU supports up to 8 GB of memory in 2 memory channels. The Qualcomm Snapdragon 625 was released in Q2/2016. |
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| HiSilicon Kirin (29) | Family | Qualcomm Snapdragon (102) |
| HiSilicon Kirin 810/820 (3) | CPU group | Qualcomm Snapdragon 625/626 (2) |
| 6 | Generation | 3 |
| Cortex-A76 / Cortex-A55 | Architecture | Cortex-A53 |
| Mobile | Segment | Mobile |
| -- | Predecessor | -- |
| -- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 810 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 810 is 2.20 GHz while the Qualcomm Snapdragon 625 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 625 is at 2.00 GHz. |
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| HiSilicon Kirin 810 | Characteristic | Qualcomm Snapdragon 625 |
| 8 | Cores | 8 |
| 8 | Threads | 8 |
| hybrid (big.LITTLE) | Core architecture | normal |
| No | Hyperthreading | No |
| No | Overclocking ? | No |
| 2.20 GHz 2x Cortex-A76 |
A-Core | 2.00 GHz 8x Cortex-A53 |
| 1.90 GHz 6x Cortex-A55 |
B-Core | -- |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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| HiSilicon Kirin 810 | Characteristic | Qualcomm Snapdragon 625 |
| -- | AI hardware | Qualcomm AI engine |
| -- | AI specifications | Hexagon 546 |
Internal GraphicsThe HiSilicon Kirin 810 or Qualcomm Snapdragon 625 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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| ARM Mali-G52 MP6 | GPU | Qualcomm Adreno 506 |
| 0.85 GHz | GPU frequency | 0.65 GHz |
| -- | GPU (Turbo) | 0.65 GHz |
| Bifrost 2 | GPU Generation | 5 |
| 12 nm | Technology | 14 nm |
| 2 | Max. displays | 0 |
| 16 | Compute units | -- |
| 288 | Shader | 96 |
| No | Hardware Raytracing | No |
| No | Frame Generation | No |
| 4 GB | Max. GPU Memory | -- |
| 12 | DirectX Version | 11 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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| ARM Mali-G52 MP6 | GPU | Qualcomm Adreno 506 |
| Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
| Decode / Encode | Codec h265 / HEVC (10 bit) | No |
| Decode / Encode | Codec h264 | Decode / Encode |
| Decode / Encode | Codec VP9 | No |
| Decode / Encode | Codec VP8 | No |
| No | Codec AV1 | No |
| Decode / Encode | Codec AVC | No |
| Decode / Encode | Codec VC-1 | Decode |
| Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 810 can use up to 6 GB of memory in 4 memory channels. The maximum memory bandwidth is --. The Qualcomm Snapdragon 625 supports up to 8 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 14.9 GB/s. |
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| HiSilicon Kirin 810 | Characteristic | Qualcomm Snapdragon 625 |
| LPDDR4X-2133 | Memory | LPDDR3-1866 |
| 6 GB | Max. Memory | 8 GB |
| 4 (Quad Channel) | Memory channels | 2 (Dual Channel) |
| -- | Max. Bandwidth | 14.9 GB/s |
| No | ECC | No |
| -- | L2 Cache | -- |
| 1.00 MB | L3 Cache | -- |
| -- | PCIe version | -- |
| -- | PCIe lanes | -- |
| -- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 810 is 5 W, while the Qualcomm Snapdragon 625 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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| HiSilicon Kirin 810 | Characteristic | Qualcomm Snapdragon 625 |
| 5 W | TDP (PL1 / PBP) | -- |
| -- | TDP (PL2) | -- |
| -- | TDP up | -- |
| -- | TDP down | -- |
| -- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 810 is manufactured in 7 nm and has 1.00 MB cache. The Qualcomm Snapdragon 625 is manufactured in 14 nm and has a 0.00 MB cache. |
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| HiSilicon Kirin 810 | Characteristic | Qualcomm Snapdragon 625 |
| 7 nm | Technology | 14 nm |
| Chiplet | Chip design | Chiplet |
| Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
| -- | ISA extensions | -- |
| -- | Socket | -- |
| None | Virtualization | None |
| No | AES-NI | No |
| Android | Operating systems | Android |
| Q2/2019 | Release date | Q2/2016 |
| -- | Release price | -- |
| show more data | show more data | |
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Rate these processors
Average performance in benchmarks
⌀ Single core performance in 2 CPU benchmarks
⌀ Multi core performance in 2 CPU benchmarks
Geekbench 5, 64bit (Single-Core)
Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The single-core test only uses one CPU core, the amount of cores or hyperthreading ability doesn't count.
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 625
8C 8T @ 2.00 GHz |
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Geekbench 5, 64bit (Multi-Core)
Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The multi-core test involves all CPU cores and taks a big advantage of hyperthreading.
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 625
8C 8T @ 2.00 GHz |
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Geekbench 6 (Single-Core)
Geekbench 6 is a benchmark for modern computers, notebooks and smartphones. What is new is an optimized utilization of newer CPU architectures, e.g. based on the big.LITTLE concept and combining CPU cores of different sizes. The single-core benchmark only evaluates the performance of the fastest CPU core, the number of CPU cores in a processor is irrelevant here.
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 625
8C 8T @ 2.00 GHz |
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Geekbench 6 (Multi-Core)
Geekbench 6 is a benchmark for modern computers, notebooks and smartphones. What is new is an optimized utilization of newer CPU architectures, e.g. based on the big.LITTLE concept and combining CPU cores of different sizes. The multi-core benchmark evaluates the performance of all of the processor's CPU cores. Virtual thread improvements such as AMD SMT or Intel's Hyper-Threading have a positive impact on the benchmark result.
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 625
8C 8T @ 2.00 GHz |
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iGPU - FP32 Performance (Single-precision GFLOPS)
The theoretical computing performance of the internal graphics unit of the processor with simple accuracy (32 bit) in GFLOPS. GFLOPS indicates how many billion floating point operations the iGPU can perform per second.
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HiSilicon Kirin 810
ARM Mali-G52 MP6 @ 0.85 GHz |
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Qualcomm Snapdragon 625
Qualcomm Adreno 506 @ 0.65 GHz |
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AnTuTu 9 Benchmark
The AnTuTu 9 benchmark is very well suited to measuring the performance of a smartphone. AnTuTu 9 is quite heavy on 3D graphics and can now also use the "Metal" graphics interface. In AnTuTu, memory and UX (user experience) are also tested by simulating browser and app usage. AnTuTu version 9 can compare any ARM CPU running on Android or iOS. Devices may not be directly comparable when benchmarked on different operating systems.
In the AnTuTu 9 benchmark, the single-core performance of a processor is only slightly weighted. The rating is made up of the multi-core performance of the processor, the speed of the working memory, and the performance of the internal graphics.
In the AnTuTu 9 benchmark, the single-core performance of a processor is only slightly weighted. The rating is made up of the multi-core performance of the processor, the speed of the working memory, and the performance of the internal graphics.
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 625
8C 8T @ 2.00 GHz |
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AnTuTu 8 Benchmark
The AnTuTu 8 Benchmark measures the performance of a SoC. AnTuTu benchmarks the CPU, GPU, Memory as well as the UX (User Experience) by simulating browser and app usage. AnTuTu can benchmark any ARM CPU that runs under Android or iOS. Devices may not be directly compareable if the benchmark has been performed under different operating systems.
In the AnTuTu 8 benchmark, the single-core performance of a processor is only slightly weighted. The evaluation consists of the multi-core performance of the processor, the speed of the RAM and the performance of the internal graphics.
In the AnTuTu 8 benchmark, the single-core performance of a processor is only slightly weighted. The evaluation consists of the multi-core performance of the processor, the speed of the RAM and the performance of the internal graphics.
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 625
8C 8T @ 2.00 GHz |
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Estimated results for PassMark CPU Mark
Some of the CPUs listed below have been benchmarked by CPU-monkey. However the majority of CPUs have not been tested and the results have been estimated by a CPU-monkey’s secret proprietary formula. As such they do not accurately reflect the actual Passmark CPU mark values and are not endorsed by PassMark Software Pty Ltd.
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HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 625
8C 8T @ 2.00 GHz |
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Devices using this processor |
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| HiSilicon Kirin 810 | Qualcomm Snapdragon 625 |
| Huawei Honor 9X Pro Huawei Honor Play 4T Pro Huawei MatePad 10.4 Huawei Nova 5i Pro Huawei P40 Lite |
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