HiSilicon Kirin 810 vs MediaTek Dimensity 1200

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CPU comparison with benchmarks


HiSilicon Kirin 810 CPU1 vs CPU2 MediaTek Dimensity 1200
HiSilicon Kirin 810 MediaTek Dimensity 1200

CPU comparison

HiSilicon Kirin 810 or MediaTek Dimensity 1200 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.

The HiSilicon Kirin 810 has 8 cores with 8 threads and clocks with a maximum frequency of 2.20 GHz. Up to 6 GB of memory is supported in 4 memory channels. The HiSilicon Kirin 810 was released in Q2/2019.

The MediaTek Dimensity 1200 has 8 cores with 8 threads and clocks with a maximum frequency of 3.00 GHz. The CPU supports up to 16 GB of memory in 4 memory channels. The MediaTek Dimensity 1200 was released in Q1/2021.
HiSilicon Kirin (29) Family Mediatek Dimensity (36)
HiSilicon Kirin 810/820 (3) CPU group MediaTek Dimensity 1100/1200/1300 (3)
6 Generation 2
Cortex-A76 / Cortex-A55 Architecture Cortex-A78 / Cortex-A55
Mobile Segment Mobile
-- Predecessor --
-- Successor --

CPU Cores and Base Frequency

The HiSilicon Kirin 810 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 810 is 2.20 GHz while the MediaTek Dimensity 1200 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the MediaTek Dimensity 1200 is at 3.00 GHz.

HiSilicon Kirin 810 Characteristic MediaTek Dimensity 1200
8 Cores 8
8 Threads 8
hybrid (big.LITTLE) Core architecture hybrid (Prime / big.LITTLE)
No Hyperthreading No
No Overclocking ? No
2.20 GHz
2x Cortex-A76
A-Core 3.00 GHz
1x Cortex-A78
1.90 GHz
6x Cortex-A55
B-Core 2.60 GHz
3x Cortex-A78
-- C-Core 2.00 GHz
4x Cortex-A55

Artificial Intelligence and Machine Learning

Processors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor.

HiSilicon Kirin 810 Characteristic MediaTek Dimensity 1200
-- AI hardware --
-- AI specifications --

Internal Graphics

The HiSilicon Kirin 810 or MediaTek Dimensity 1200 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.

ARM Mali-G52 MP6 GPU ARM Mali-G77 MP9
0.85 GHz GPU frequency 0.85 GHz
-- GPU (Turbo) --
Bifrost 2 GPU Generation Vallhall 1
12 nm Technology 7 nm
2 Max. displays 1
16 Compute units 9
288 Shader 144
No Hardware Raytracing No
No Frame Generation No
4 GB Max. GPU Memory 4 GB
12 DirectX Version 12

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.

ARM Mali-G52 MP6 GPU ARM Mali-G77 MP9
Decode / Encode Codec h265 / HEVC (8 bit) Decode / Encode
Decode / Encode Codec h265 / HEVC (10 bit) Decode / Encode
Decode / Encode Codec h264 Decode / Encode
Decode / Encode Codec VP9 Decode / Encode
Decode / Encode Codec VP8 Decode / Encode
No Codec AV1 Decode
Decode / Encode Codec AVC Decode / Encode
Decode / Encode Codec VC-1 Decode / Encode
Decode / Encode Codec JPEG Decode / Encode

Memory & PCIe

The HiSilicon Kirin 810 can use up to 6 GB of memory in 4 memory channels. The maximum memory bandwidth is --. The MediaTek Dimensity 1200 supports up to 16 GB of memory in 4 memory channels and achieves a memory bandwidth of up to 34.1 GB/s.

HiSilicon Kirin 810 Characteristic MediaTek Dimensity 1200
LPDDR4X-2133 Memory LPDDR4X-4266
6 GB Max. Memory 16 GB
4 (Quad Channel) Memory channels 4 (Quad Channel)
-- Max. Bandwidth 34.1 GB/s
No ECC No
-- L2 Cache --
1.00 MB L3 Cache --
-- PCIe version --
-- PCIe lanes --
-- PCIe Bandwidth --

Thermal Management

The thermal design power (TDP for short) of the HiSilicon Kirin 810 is 5 W, while the MediaTek Dimensity 1200 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently.

HiSilicon Kirin 810 Characteristic MediaTek Dimensity 1200
5 W TDP (PL1 / PBP) --
-- TDP (PL2) --
-- TDP up --
-- TDP down --
-- Tjunction max. --

Technical details

The HiSilicon Kirin 810 is manufactured in 7 nm and has 1.00 MB cache. The MediaTek Dimensity 1200 is manufactured in 6 nm and has a 0.00 MB cache.

HiSilicon Kirin 810 Characteristic MediaTek Dimensity 1200
7 nm Technology 6 nm
Chiplet Chip design Chiplet
Armv8-A (64 bit) Instruction set (ISA) Armv8-A (64 bit)
-- ISA extensions --
-- Socket --
None Virtualization None
No AES-NI No
Android Operating systems Android
Q2/2019 Release date Q1/2021
-- Release price --
show more data show more data


Rate these processors

Here you can rate the HiSilicon Kirin 810 to help other visitors make their purchasing decisions. The average rating is 4.5 stars (2 ratings). Rate now:
Here you can rate the MediaTek Dimensity 1200 to help other visitors make their purchasing decisions. The average rating is 2.5 stars (2 ratings). Rate now:


Average performance in benchmarks

⌀ Single core performance in 2 CPU benchmarks
HiSilicon Kirin 810 (69%)
MediaTek Dimensity 1200 (100%)
⌀ Multi core performance in 3 CPU benchmarks
HiSilicon Kirin 810 (59%)
MediaTek Dimensity 1200 (100%)

Geekbench 5, 64bit (Single-Core)

Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The single-core test only uses one CPU core, the amount of cores or hyperthreading ability doesn't count.
HiSilicon Kirin 810 HiSilicon Kirin 810
8C 8T @ 2.20 GHz
592 (68%)
MediaTek Dimensity 1200 MediaTek Dimensity 1200
8C 8T @ 3.00 GHz
868 (100%)

Geekbench 5, 64bit (Multi-Core)

Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The multi-core test involves all CPU cores and taks a big advantage of hyperthreading.
HiSilicon Kirin 810 HiSilicon Kirin 810
8C 8T @ 2.20 GHz
1898 (62%)
MediaTek Dimensity 1200 MediaTek Dimensity 1200
8C 8T @ 3.00 GHz
3075 (100%)

Geekbench 6 (Single-Core)

Geekbench 6 is a benchmark for modern computers, notebooks and smartphones. What is new is an optimized utilization of newer CPU architectures, e.g. based on the big.LITTLE concept and combining CPU cores of different sizes. The single-core benchmark only evaluates the performance of the fastest CPU core, the number of CPU cores in a processor is irrelevant here.
HiSilicon Kirin 810 HiSilicon Kirin 810
8C 8T @ 2.20 GHz
772 (69%)
MediaTek Dimensity 1200 MediaTek Dimensity 1200
8C 8T @ 3.00 GHz
1114 (100%)

Geekbench 6 (Multi-Core)

Geekbench 6 is a benchmark for modern computers, notebooks and smartphones. What is new is an optimized utilization of newer CPU architectures, e.g. based on the big.LITTLE concept and combining CPU cores of different sizes. The multi-core benchmark evaluates the performance of all of the processor's CPU cores. Virtual thread improvements such as AMD SMT or Intel's Hyper-Threading have a positive impact on the benchmark result.
HiSilicon Kirin 810 HiSilicon Kirin 810
8C 8T @ 2.20 GHz
2035 (64%)
MediaTek Dimensity 1200 MediaTek Dimensity 1200
8C 8T @ 3.00 GHz
3165 (100%)

iGPU - FP32 Performance (Single-precision GFLOPS)

The theoretical computing performance of the internal graphics unit of the processor with simple accuracy (32 bit) in GFLOPS. GFLOPS indicates how many billion floating point operations the iGPU can perform per second.
HiSilicon Kirin 810 HiSilicon Kirin 810
ARM Mali-G52 MP6 @ 0.85 GHz
122 (13%)
MediaTek Dimensity 1200 MediaTek Dimensity 1200
ARM Mali-G77 MP9 @ 0.85 GHz
979 (100%)

AnTuTu 9 Benchmark

The AnTuTu 9 benchmark is very well suited to measuring the performance of a smartphone. AnTuTu 9 is quite heavy on 3D graphics and can now also use the "Metal" graphics interface. In AnTuTu, memory and UX (user experience) are also tested by simulating browser and app usage. AnTuTu version 9 can compare any ARM CPU running on Android or iOS. Devices may not be directly comparable when benchmarked on different operating systems.

In the AnTuTu 9 benchmark, the single-core performance of a processor is only slightly weighted. The rating is made up of the multi-core performance of the processor, the speed of the working memory, and the performance of the internal graphics.
HiSilicon Kirin 810 HiSilicon Kirin 810
8C 8T @ 2.20 GHz
338464 (51%)
MediaTek Dimensity 1200 MediaTek Dimensity 1200
8C 8T @ 3.00 GHz
669042 (100%)

AnTuTu 8 Benchmark

The AnTuTu 8 Benchmark measures the performance of a SoC. AnTuTu benchmarks the CPU, GPU, Memory as well as the UX (User Experience) by simulating browser and app usage. AnTuTu can benchmark any ARM CPU that runs under Android or iOS. Devices may not be directly compareable if the benchmark has been performed under different operating systems.

In the AnTuTu 8 benchmark, the single-core performance of a processor is only slightly weighted. The evaluation consists of the multi-core performance of the processor, the speed of the RAM and the performance of the internal graphics.
HiSilicon Kirin 810 HiSilicon Kirin 810
8C 8T @ 2.20 GHz
301946 (48%)
MediaTek Dimensity 1200 MediaTek Dimensity 1200
8C 8T @ 3.00 GHz
627817 (100%)

Estimated results for PassMark CPU Mark

Some of the CPUs listed below have been benchmarked by CPU-monkey. However the majority of CPUs have not been tested and the results have been estimated by a CPU-monkey’s secret proprietary formula. As such they do not accurately reflect the actual Passmark CPU mark values and are not endorsed by PassMark Software Pty Ltd.
HiSilicon Kirin 810 HiSilicon Kirin 810
8C 8T @ 2.20 GHz
0 (0%)
MediaTek Dimensity 1200 MediaTek Dimensity 1200
8C 8T @ 3.00 GHz
5143 (100%)

Devices using this processor

HiSilicon Kirin 810 MediaTek Dimensity 1200
Huawei Honor 9X Pro
Huawei Honor Play 4T Pro
Huawei MatePad 10.4
Huawei Nova 5i Pro
Huawei P40 Lite
OnePlus Nord 2

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