HiSilicon Kirin 650 vs Qualcomm Snapdragon 617

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CPU comparison with benchmarks


HiSilicon Kirin 650 CPU1 vs CPU2 Qualcomm Snapdragon 617
HiSilicon Kirin 650 Qualcomm Snapdragon 617

CPU comparison

HiSilicon Kirin 650 or Qualcomm Snapdragon 617 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.

The HiSilicon Kirin 650 has 8 cores with 8 threads and clocks with a maximum frequency of 2.00 GHz. Up to GB of memory is supported in 2 memory channels. The HiSilicon Kirin 650 was released in Q2/2016.

The Qualcomm Snapdragon 617 has 8 cores with 8 threads and clocks with a maximum frequency of 1.50 GHz. The CPU supports up to 4 GB of memory in 1 memory channels. The Qualcomm Snapdragon 617 was released in Q4/2015.
HiSilicon Kirin (29) Family Qualcomm Snapdragon (102)
HiSilicon Kirin 650 (4) CPU group Qualcomm Snapdragon 610 (4)
4 Generation 2
Cortex-A53 / Cortex-A53 Architecture Cortex-A53
Mobile Segment Mobile
-- Predecessor --
-- Successor --

CPU Cores and Base Frequency

The HiSilicon Kirin 650 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 650 is 2.00 GHz while the Qualcomm Snapdragon 617 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 617 is at 1.50 GHz.

HiSilicon Kirin 650 Characteristic Qualcomm Snapdragon 617
8 Cores 8
8 Threads 8
hybrid (big.LITTLE) Core architecture hybrid (big.LITTLE)
No Hyperthreading No
No Overclocking ? No
2.00 GHz
4x Cortex-A53
A-Core 1.50 GHz
4x Cortex-A53
1.70 GHz
4x Cortex-A53
B-Core 1.20 GHz
4x Cortex-A53

Artificial Intelligence and Machine Learning

Processors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor.

HiSilicon Kirin 650 Characteristic Qualcomm Snapdragon 617
-- AI hardware Qualcomm AI engine
-- AI specifications Hexagon 546

Internal Graphics

The HiSilicon Kirin 650 or Qualcomm Snapdragon 617 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.

ARM Mali-T830 MP2 GPU Qualcomm Adreno 405
0.90 GHz GPU frequency 0.55 GHz
-- GPU (Turbo) 0.55 GHz
Midgard 4 GPU Generation 4
28nm Technology 28 nm
2 Max. displays 0
2 Compute units --
32 Shader 48
No Hardware Raytracing No
No Frame Generation No
-- Max. GPU Memory --
11 DirectX Version 11

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.

ARM Mali-T830 MP2 GPU Qualcomm Adreno 405
Decode / Encode Codec h265 / HEVC (8 bit) Decode
Decode Codec h265 / HEVC (10 bit) No
Decode / Encode Codec h264 Decode / Encode
No Codec VP9 No
Decode / Encode Codec VP8 No
No Codec AV1 No
No Codec AVC No
No Codec VC-1 Decode
Decode / Encode Codec JPEG Decode / Encode

Memory & PCIe

The HiSilicon Kirin 650 can use up to GB of memory in 2 memory channels. The maximum memory bandwidth is --. The Qualcomm Snapdragon 617 supports up to 4 GB of memory in 1 memory channels and achieves a memory bandwidth of up to 7.5 GB/s.

HiSilicon Kirin 650 Characteristic Qualcomm Snapdragon 617
LPDDR3-933 Memory LPDDR3-1866
Max. Memory 4 GB
2 (Dual Channel) Memory channels 1 (Single Channel)
-- Max. Bandwidth 7.5 GB/s
No ECC No
-- L2 Cache --
-- L3 Cache --
-- PCIe version --
-- PCIe lanes --
-- PCIe Bandwidth --

Thermal Management

The thermal design power (TDP for short) of the HiSilicon Kirin 650 is --, while the Qualcomm Snapdragon 617 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently.

HiSilicon Kirin 650 Characteristic Qualcomm Snapdragon 617
-- TDP (PL1 / PBP) --
-- TDP (PL2) --
-- TDP up --
-- TDP down --
-- Tjunction max. --

Technical details

The HiSilicon Kirin 650 is manufactured in 16 nm and has 0.00 MB cache. The Qualcomm Snapdragon 617 is manufactured in 28 nm and has a 0.00 MB cache.

HiSilicon Kirin 650 Characteristic Qualcomm Snapdragon 617
16 nm Technology 28 nm
Chiplet Chip design Chiplet
Armv8-A (64 bit) Instruction set (ISA) Armv8-A (64 bit)
-- ISA extensions --
-- Socket --
None Virtualization None
No AES-NI No
Android Operating systems Android
Q2/2016 Release date Q4/2015
-- Release price --
show more data show more data


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Average performance in benchmarks

⌀ Single core performance in 1 CPU benchmarks
⌀ Multi core performance in 1 CPU benchmarks

Geekbench 5, 64bit (Single-Core)

Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The single-core test only uses one CPU core, the amount of cores or hyperthreading ability doesn't count.
HiSilicon Kirin 650 HiSilicon Kirin 650
8C 8T @ 2.00 GHz
163 (57%)
Qualcomm Snapdragon 617 Qualcomm Snapdragon 617
8C 8T @ 1.50 GHz
287 (100%)

Geekbench 5, 64bit (Multi-Core)

Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The multi-core test involves all CPU cores and taks a big advantage of hyperthreading.
HiSilicon Kirin 650 HiSilicon Kirin 650
8C 8T @ 2.00 GHz
763 (65%)
Qualcomm Snapdragon 617 Qualcomm Snapdragon 617
8C 8T @ 1.50 GHz
1176 (100%)

iGPU - FP32 Performance (Single-precision GFLOPS)

The theoretical computing performance of the internal graphics unit of the processor with simple accuracy (32 bit) in GFLOPS. GFLOPS indicates how many billion floating point operations the iGPU can perform per second.
HiSilicon Kirin 650 HiSilicon Kirin 650
ARM Mali-T830 MP2 @ 0.90 GHz
61 (100%)
Qualcomm Snapdragon 617 Qualcomm Snapdragon 617
Qualcomm Adreno 405 @ 0.55 GHz
53 (86%)

Geekbench 6 (Single-Core)

Geekbench 6 is a benchmark for modern computers, notebooks and smartphones. What is new is an optimized utilization of newer CPU architectures, e.g. based on the big.LITTLE concept and combining CPU cores of different sizes. The single-core benchmark only evaluates the performance of the fastest CPU core, the number of CPU cores in a processor is irrelevant here.
HiSilicon Kirin 650 HiSilicon Kirin 650
8C 8T @ 2.00 GHz
0 (0%)
Qualcomm Snapdragon 617 Qualcomm Snapdragon 617
8C 8T @ 1.50 GHz
301 (100%)

Geekbench 6 (Multi-Core)

Geekbench 6 is a benchmark for modern computers, notebooks and smartphones. What is new is an optimized utilization of newer CPU architectures, e.g. based on the big.LITTLE concept and combining CPU cores of different sizes. The multi-core benchmark evaluates the performance of all of the processor's CPU cores. Virtual thread improvements such as AMD SMT or Intel's Hyper-Threading have a positive impact on the benchmark result.
HiSilicon Kirin 650 HiSilicon Kirin 650
8C 8T @ 2.00 GHz
0 (0%)
Qualcomm Snapdragon 617 Qualcomm Snapdragon 617
8C 8T @ 1.50 GHz
867 (100%)

Estimated results for PassMark CPU Mark

Some of the CPUs listed below have been benchmarked by CPU-monkey. However the majority of CPUs have not been tested and the results have been estimated by a CPU-monkey’s secret proprietary formula. As such they do not accurately reflect the actual Passmark CPU mark values and are not endorsed by PassMark Software Pty Ltd.
HiSilicon Kirin 650 HiSilicon Kirin 650
8C 8T @ 2.00 GHz
0 (0%)
Qualcomm Snapdragon 617 Qualcomm Snapdragon 617
8C 8T @ 1.50 GHz
893 (100%)

Devices using this processor

HiSilicon Kirin 650 Qualcomm Snapdragon 617
Unknown Unknown

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